Thermoplastic copolyamides for assembly of textiles
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Solution Overview
Problem
Existing hot-melt adhesives used for seamless textile assembly by printing, such as HMPUR, have limited open time, contain toxic residual isocyanate monomers, and are infusible, making them difficult to recycle and pose health and environmental concerns.
Innovation Solution
Copolyamides with hard and soft segments, specifically designed to have a melting temperature above 80°C and viscosity suitable for printing, offering flexibility, improved health and environmental safety, and recyclability, are used for seamless textile assembly by printing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If HMPUR adhesives are used for seamless textile assembly by printing, then adhesion performance is achieved, but the adhesive has limited open time after activation
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive from reactive HMPUR to non-reactive copolyamides with specific melting points (80-200°C) and molecular weights (5000-50000 g/mol), eliminating the open time limitation while maintaining adhesion performance through thermoplastic bonding mechanisms
Solution Approach 2:
The patent adopts thermoplastic copolyamides that can be repeatedly melted and reprocessed, replacing the single-use reactive HMPUR adhesives with limited working time, enabling multiple assembly attempts and adjustments without losing adhesive effectiveness
2Reliability
If HMPUR adhesives are used for seamless textile assembly, then bonding is achieved, but toxic residual isocyanate monomers remain causing health and environmental concerns
Solution Approach 1:
The patent extracts and eliminates the harmful isocyanate monomer component from the adhesive system by replacing HMPUR chemistry with copolyamide chemistry, removing the toxic substance while retaining the essential bonding function through thermoplastic adhesion
Solution Approach 2:
The patent converts the previously harmful reactive chemistry into a beneficial non-reactive thermoplastic system where the absence of toxic monomers and the presence of recyclable polymer structures provide both health safety and environmental benefits alongside bonding performance
3Reliability
If HMPUR adhesives are used for textile assembly, then bonding is achieved, but the adhesives are crosslinkable and infusible making them difficult to recycle
Solution Approach 1:
The patent introduces dynamic reversibility to the bonding system by using thermoplastic copolyamides that can transition between solid and melt states, allowing the bonded textiles to be reprocessed, remelted, and recycled multiple times unlike the static crosslinked HMPUR bonds
Solution Approach 2:
The patent enables recovery and reuse of the adhesive material by eliminating crosslinking in favor of thermoplastic copolyamides that can be melted down and reprocessed, allowing discarded bonded textiles to be recovered and the adhesive to be reused in new applications
4Reliability
If copolyamides with melting point above 80°C are used for seamless textile assembly, then washing resistance is improved, but bonding temperature requirements increase
Solution Approach 1:
The patent optimizes the melting point parameter of copolyamides to fall within 80-200°C, balancing washing resistance (requiring higher melting points) with textile substrate temperature tolerance (requiring lower bonding temperatures), achieving both goals through careful selection of copolymer composition and molecular weight
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The copolyamides provide strong adhesion, are recyclable, and maintain performance after washing, addressing the limitations of traditional adhesives by offering a flexible, environmentally friendly, and recyclable solution for seamless textile assembly.
Implementation Method 1
hot-melt adhesives which, pre-melted, make it possible to assemble various substrates by bonding during cooling
Implementation Method 2
assemble various substrates by bonding during cooling
Data Source
AI summary
The use, for seamless textile assembly by printing, of a copolyamide including: a) at least one hard segment obtained by polycondensation of at least one of the following: (i) an α,ω-aminocarboxylic acid; (ii) a lactam; and/or (iii) an aliphatic diacid with 6 to 22 carbon atoms and at least one aliphatic diamine with 2 to 14 carbon atoms, and, optionally, b) at least one soft segment obtained by polycondensation of at least one diacid with 4 to 44 carbon atoms with at least one diamine chosen from diamines with 2 to 44 carbon atoms and polyoxyalkylene diamines, the copolyamide having a melting temperature Tm above 80° C. and below 210° C. and a viscosity at 170° C., as measured according to standard ASTM D3236-88 (2009), using a Brookfield rheometer with SC 4-27 spindle, of between 5 Pa·s and 100-200 Pa·s.