Thermoplastic Face Plate Retaining Element for PCB Mounting

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Solution Overview

Problem

Conventional face plate assemblies for mounting electronic components on racks are complex and costly due to the use of multiple parts, particularly the need for standoffs with metal face plates, which complicate manufacturing and increase costs.

Innovation Solution

A thermoplastic face plate with molded retaining elements that expand to secure captive screws and springs, allowing for a simpler and cost-effective assembly by using injection molding techniques, reducing the complexity and cost of manufacturing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If metal face plates with standoffs and multiple parts are used, then EMI shielding capability is achieved, but manufacturing complexity and cost increase

Engineering Contradiction:
ImproveEMI shielding capabilityVSAvoidmanufacturing complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent combines multiple separate components (face plate, standoff, retaining element) into a single integrated thermoplastic face plate with molded-in retaining elements. This merging eliminates the need for separate standoffs and reduces assembly steps while maintaining EMI shielding through conductive thermoplastic material or conductive coating

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent uses composite materials - either conductive thermoplastic material or non-conductive thermoplastic with conductive coating - to achieve EMI shielding functionality within the face plate itself, eliminating the need for separate metal shielding components

Inventive Principle:
Principle #40Composite materials

2Reliability

If multiple parts including standoffs and captive screws are used, then secure mounting of PCBs is achieved, but the number of parts and assembly complexity increase

Engineering Contradiction:
Improvesecure mountingVSAvoidnumber of parts
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The retaining element that secures captive screws is molded directly into the face plate as an integrated feature, eliminating separate standoff components. The slots in the retaining element expand to capture screw shanks, providing secure mounting with fewer parts

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The slots in the molded retaining element automatically expand upon screw insertion to capture and secure the screw shank, providing self-aligning and self-securing functionality without requiring additional adjustment or separate components

Inventive Principle:
Principle #25Self-service

3Strength

If conventional metal face plate manufacturing is used, then structural strength is achieved, but manufacturing cost and time increase

Engineering Contradiction:
Improvestructural strengthVSAvoidmanufacturing efficiency
Core Design Contradiction:
StrengthVSProductivity

Solution Approach 1:

The patent transitions from metal material to thermoplastic material, changing the material parameters while achieving sufficient structural strength through the molding process and integrated design of retaining elements with slots that provide mechanical interlocking

Inventive Principle:
Principle #35Parameter changes

4Reliability

If standoffs are press-fit into metal face plates, then screw assembly retention is achieved, but assembly complexity and manufacturing steps increase

Engineering Contradiction:
Improvescrew assembly retentionVSAvoidmanufacturing ease
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The retaining element with slots is molded directly into the face plate as an integrated feature, eliminating the need for separate standoffs that require press-fitting. The slots are formed directly in the molded plastic, providing screw retention without additional assembly steps

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The retaining elements with slots are pre-formed during the face plate molding process itself, before final assembly. This preliminary formation of retention features eliminates subsequent assembly steps required for separate standoffs

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a cost-effective and simplified assembly for mounting electronic components, reducing manufacturing complexity and costs by over 15% compared to conventional systems, while maintaining effective EMI shielding capabilities.

Implementation Method 1

The retaining element includes at least one or more slots which expand upon insertion of the threaded portion of the screw, and to contract to lock the shank portion of the screw in place when the threaded portion has passed through the hole

Methodology Applied
Scientific EffectElastic deformation: Elasticity

Implementation Method 2

The face plate can be advantageously manufactured by injection molding techniques

Methodology Applied
Scientific EffectInjection molding:

Data Source

PatentUS8439615B2Assembly for mounting electronic components, methods of use and manufacture thereof
Publication Date: 2013.05.14 PARKER INTANGIBLES LLC
  • US8439615B2 patent drawing
  • US8439615B2 patent drawing
  • US8439615B2 patent drawing

AI summary

An assembly for mounting electronic components includes a face plate comprising a thermoplastic material. The face plate includes a retaining element for securing a captive screw and spring assembly for mounting an electronic printed circuit board. The retaining element includes one or more slots adapted to expand the element to permit insertion of the screw and deformation of the hole upon insertion of the screw, while locking the screw to retain the screw in place. This arrangement permits the elimination of the metal standoff frequently used in similar devices. Methods for preparing the assembly and mounting the printed circuit boards are also described.