Thermoplastic Thermal Interface Joining for Irregular Shapes
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Solution Overview
Problem
Conventional thermal interface materials (TIMs) face challenges such as low handleability, unsuitability for production lines, difficulty in conforming to complex shapes, and performance degradation due to long-term use, making them unsuitable for efficient heat dissipation in electronic devices.
Innovation Solution
A method using a solid thermally-conductive material composed of a thermoplastic resin and heat dissipation filler, with a resin content of 51% by mass or more, which is melted and solidified to join heating elements to heat dissipation parts, conforming to irregular shapes and maintaining performance over time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal grease is used to conform to irregular shapes and increase thermal conduction efficiency, then thermal conduction efficiency is improved, but handleability and suitability for existing production lines deteriorate
Solution Approach 1:
The patent changes the physical state parameter of the thermally-conductive material from liquid (thermal grease) to solid (thermally-conductive sheet), transforming it into a solid material that maintains thermal conduction efficiency while improving handleability and suitability for production lines
Solution Approach 2:
The patent uses a composite material structure consisting of a resin base material combined with thermally-conductive particles, creating a solid thermally-conductive sheet that achieves both good thermal conduction properties and ease of handling
2Reliability
If thermal grease is used to fill gaps and conform to complex shapes, then thermal conduction efficiency is improved, but long-term reliability deteriorates due to pump-out and coagulation
Solution Approach 1:
The patent changes the physical state from liquid to solid, eliminating the pump-out phenomenon that occurs in liquid thermal greases over time, thereby improving long-term reliability while maintaining thermal conduction efficiency
Solution Approach 2:
The patent adopts a solid thermally-conductive sheet that maintains stable performance over time without the degradation issues of liquid greases, providing reliable long-term heat dissipation
3Reliability
If PCM is used to conform to irregular shapes through phase change, then thermal conduction efficiency is improved, but volume change and void generation occur during solidification
Solution Approach 1:
The patent uses a solid thermally-conductive material that can be softened by heat rather than undergoing phase change from solid to liquid, eliminating volume expansion and void generation that occur during PCM solidification while maintaining thermal conduction efficiency
Solution Approach 2:
The patent utilizes thermal softening of the solid material rather than phase change, allowing the material to conform to irregular shapes through controlled softening and cooling without the harmful volume changes associated with PCM phase transitions
4Ease of operation
If heat dissipation sheet is used for easy handling and thickness control, then ease of operation is improved, but ability to conform to irregular shapes deteriorates
Solution Approach 1:
The patent uses a solid thermally-conductive sheet material that combines the handleability of solid materials with the ability to conform to irregular shapes through controlled softening, achieving both ease of operation and effective thermal conduction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances suitability for production lines and design flexibility while reducing performance degradation, ensuring effective heat dissipation by conforming to complex shapes and maintaining stability over time.
Implementation Method 1
the solid thermally-conductive material is melted and solidified to join the heating element A to the heat dissipation part B
Implementation Method 2
a solid thermally-conductive material containing a thermoplastic resin and a heat dissipation filler
Data Source
Figure 1
AI summary
Provided is a method for joining a heating element to a heating element or a heat dissipation part to a heat dissipation part through a solid thermally-conductive material. A heating element A and a heat dissipation part B or a heat dissipation part B2 and a heat dissipation part B3 are joined to each other through a solid thermally-conductive material containing a thermoplastic resin and a heat dissipation filler, the thermoplastic resin having a content of 51% by mass or more of a resin component in the solid thermally-conductive material.