Thermoplastic Composition for Laser Direct Structured Substrates

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Solution Overview

Problem

Existing thermoplastic compositions for electronic components, such as those used in portable computers and handheld devices, face challenges in achieving a high dielectric constant while maintaining excellent mechanical properties and processibility, particularly when used in laser direct structuring processes, and are unsuitable for lead-free soldering and high temperature resistance.

Innovation Solution

A thermoplastic composition comprising 20-80 wt% thermotropic liquid crystalline polymer, 0.1-30 wt% laser activatable additive with spinel crystals, and 1-50 wt% dielectric material, along with 5-50 wt% fibrous filler, which provides a high dielectric constant, good mechanical properties, and low viscosity, enabling efficient laser direct structuring and integration of multiple conductive elements like antennas.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If flame retardant is added to the thermoplastic composition, then flame resistance is improved, but mechanical properties deteriorate

Engineering Contradiction:
Improveflame resistanceVSAvoidmechanical properties
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent removes the flame retardant component from the thermoplastic composition entirely, relying on the inherent flame resistance of the liquid crystalline polymer and alternative materials to achieve the desired flame rating without compromising mechanical properties

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent uses a composite material system consisting of liquid crystalline polymer, dielectric material, and fibrous filler to achieve both flame resistance and mechanical strength simultaneously, replacing the need for flame retardant additives

Inventive Principle:
Principle #40Composite materials

2Reliability

If high loading of dielectric material is used to achieve high dielectric constant, then dielectric performance is improved, but mechanical properties and processibility deteriorate

Engineering Contradiction:
Improvedielectric constantVSAvoidmechanical properties
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent optimizes the dielectric constant by selecting specific dielectric materials with appropriate particle sizes and shapes, and by controlling their distribution within the polymer matrix, rather than simply increasing loading quantity. This maintains mechanical properties while achieving the required dielectric performance

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite material system where dielectric material particles are dispersed in the liquid crystalline polymer matrix with fibrous filler reinforcement, achieving high dielectric constant (greater than 4.4) while maintaining mechanical strength and processibility through proper material selection and ratio optimization

Inventive Principle:
Principle #40Composite materials

3Reliability

If high loading of dielectric material is used to achieve high dielectric constant, then dielectric performance is improved, but viscosity increases

Engineering Contradiction:
Improvedielectric constantVSAvoidviscosity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent controls viscosity by selecting dielectric materials with appropriate particle size distributions and by optimizing the overall composition ratios, ensuring the material remains processable through injection molding while achieving the required dielectric constant

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent ensures uniform local distribution of dielectric material particles throughout the polymer matrix, preventing aggregation and maintaining consistent viscosity and flow characteristics during processing

Inventive Principle:
Principle #3Local quality

4Ease of manufacture

If conventional thermoplastic composition is used, then processibility is maintained, but laser direct structuring activation is insufficient

Engineering Contradiction:
ImproveprocessibilityVSAvoidlaser direct structuring activation
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent incorporates laser activatable additives (metal particles or compounds) into the liquid crystalline polymer matrix to create a composite material that responds to laser irradiation by undergoing chemical or physical changes, enabling precise conductive pathway formation while maintaining good injection molding processibility

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent optimizes the concentration and type of laser activatable additives to achieve sufficient laser response for conductive element formation while maintaining the material's processibility through injection molding and other manufacturing processes

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition achieves a dielectric constant greater than 4.4, high melting temperature, and excellent mechanical properties, allowing for the formation of thin, high-performance antenna structures suitable for various electronic components with improved thermal and mechanical resilience.

Implementation Method 1

a computer-controlled laser beam travels over the plastic substrate to activate its surface at locations where the conductive path is to be situated

Methodology Applied
Scientific EffectLaser direct structuring: Laser Ablation

Implementation Method 2

a blend of polyphenylene oxide, nylon, or polyamide with barium titanate and copper chromium oxide spinel

Methodology Applied
Scientific EffectPhase transition: Phase Change

Data Source

PatentUS9074070B2Thermoplastic composition for use in forming a laser direct structured substrate
Publication Date: 2015.07.07 TICONA LLC
  • US9074070B2 patent drawing
  • US9074070B2 patent drawing
  • US9074070B2 patent drawing

AI summary

A thermoplastic composition that contains a unique combination of a thermotropic liquid crystalline polymer, dielectric material, laser activatable additive, and a fibrous filler is provided. The nature of the components and/or their concentration are selectively controlled in the present invention to maintain a high dielectric constant, good mechanical properties (e.g., deflection under load), and good processibility (e.g., low viscosity), yet still be laser activatable. Thus, the thermoplastic composition can be readily shaped into a thin substrate and subsequently applied with one or more conductive elements using a laser direct structuring process (“LDS”).