Thermoplastic Resin Sensor Housing Welding for Cost Reduction

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Solution Overview

Problem

The use of high-heat-conductive seal members filled with metal-based fillers in temperature sensor devices for internal combustion engines is costly and time-consuming due to their high viscosity, leading to inconsistent application and increased processing costs.

Innovation Solution

A temperature sensor device is designed using a housing and case made from thermoplastic resin, integrating a temperature sensor module with a lead wire and external connection terminals, and covered with a second formation member, eliminating the need for a high-heat-conductive seal member by using a thermoplastic resin for protection and connection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a high-heat-conductive seal member filled with metal-based high-heat-conductive filler is used to protect the temperature detection element, then reliability and temperature responsiveness are improved, but the viscosity of the seal member is high, making it time-consuming to apply and difficult to uniform the application amount, leading to increased processing cost

Engineering Contradiction:
Improveprotection of temperature detection elementVSAvoidapplication time and processing cost
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent replaces the expensive, difficult-to-apply high-heat-conductive seal member with a standard thermoplastic resin that is cheaper and easier to process. The thermoplastic resin forms protective formation members (first and second formation members) that provide sufficient protection for the temperature detection element without requiring the expensive metal-filled sealant, thus reducing both material cost and application complexity.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent changes the material parameter from high-viscosity metal-filled sealant to low-viscosity thermoplastic resin. This parameter change allows for easier application, more uniform coating, and reduced processing time while still achieving the required protection and heat conduction functionality through the welded formation members.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If a high-heat-conductive seal member filled with metal-based high-heat-conductive filler is used, then temperature responsiveness is improved, but the material cost increases

Engineering Contradiction:
Improvetemperature responsivenessVSAvoidmaterial cost
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

The patent substitutes the expensive metal-filled high-heat-conductive seal member with a standard thermoplastic resin that is significantly cheaper. The thermoplastic resin, when molded into formation members and welded, provides adequate heat conduction and protection without the high material cost of metal-filled compounds, thus reducing overall component cost.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent uses composite construction with multiple thermoplastic resin formation members (first formation member integrating the sensor module, second formation member covering it) that work together to provide heat conduction and protection. This composite approach using standard thermoplastics replaces the need for expensive metal-filled sealants while maintaining functional performance.

Inventive Principle:
Principle #40Composite materials

3Reliability

If a high-heat-conductive seal member is used, then protection of the temperature detection element is achieved, but the application amount is difficult to uniform and varies, leading to increased processing cost

Engineering Contradiction:
Improveprotection of temperature detection elementVSAvoiduniformity of application amount
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent replaces the difficult-to-apply high-heat-conductive seal member with thermoplastic resin that can be molded into precise formation members using standard injection molding or similar processes. This molding approach ensures uniform thickness and consistent protection without the variability inherent in applying high-viscosity sealants, thereby improving manufacturing precision and reducing rework.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent replaces the manual or automated sealing process (mechanical application of viscous sealant) with a molding process that forms the thermoplastic resin into precise formation members. This substitution of the application method eliminates the uniformity issues associated with applying high-viscosity materials, as the molded parts are formed with consistent dimensions directly in the mold.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design achieves high reliability and cost-effectiveness by preventing the use of high-heat-conductive seal members, maintaining temperature responsiveness, and preventing contaminant entry while reducing material costs.

Implementation Method 1

the first formation member and the second formation member are welded to each other

Methodology Applied
Scientific EffectWelding: Welding

Implementation Method 2

a temperature sensor module having a temperature detection element and an external connection terminal connected to the temperature detection element via a lead wire, which are integrated using a first formation member made from a thermoplastic resin

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS11402274B2Temperature sensor device
Publication Date: 2022.08.02 MITSUBISHI ELECTRIC MOBILITY CORP
  • US11402274B2 patent drawing
  • US11402274B2 patent drawing
  • US11402274B2 patent drawing

AI summary

To obtain a temperature sensor device having high reliability and high sensitivity without cost increase. This temperature sensor device includes: a housing provided with a temperature sensor module having a temperature detection element and an external connection terminal connected to the temperature detection element via a lead wire, which are integrated using a first formation member made from a thermoplastic resin, the temperature sensor module being covered with a second formation member made from a thermoplastic resin, so as to form a connector for connecting the external connection terminal to an external signal processing circuit; and a case into which the temperature sensor module is press-fitted and which is opposed to the housing, wherein the first formation member and the second formation member are welded to each other.