Thermoplastic Packaging Element Integrating Electronic Sensors
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Solution Overview
Problem
Existing packaging solutions fail to provide accurate information about the condition of contents, especially in disposable packaging, due to indirect methods and high costs associated with advanced technologies.
Innovation Solution
A plastic element for packaging made from thermoplastic materials, integrated with electronic components such as sensors and transmitters, which can be arranged on or within the packaging to monitor and communicate the condition of contents, including temperature, pH, and oxygen levels, facilitating cost-effective and precise tracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If electronic components are integrated into disposable packaging, then measurement precision and information accuracy improve, but device complexity and manufacturing costs increase
Solution Approach 1:
The patent combines electronic components (sensor, transmitter, power supply) with the packaging structure by integrating them into the plastic element. The sensor is arranged on or in the plastic element, the transmitter is integrated into the plastic element, and the power supply is arranged in the plastic element, creating a unified component rather than separate attached parts.
Solution Approach 2:
The plastic element serves multiple functions: it provides structural support for the packaging, integrates the sensor for condition monitoring, houses the transmitter for wireless communication, and contains the power supply. This multi-functionality reduces the need for separate components and simplifies the overall device structure.
2Loss of information
If sensors and electronic components are integrated into packaging, then information accuracy improves, but manufacturing costs increase
Solution Approach 1:
The patent combines multiple functions (structural support, sensing, communication, power supply) into a single integrated plastic element, reducing the number of assembly steps and components. This integration approach lowers manufacturing complexity and costs while maintaining accurate condition monitoring capabilities.
Solution Approach 2:
The patent uses a plastic element as the base material, which can be easily molded and shaped during standard manufacturing processes. This allows electronic components to be embedded during the molding process rather than requiring separate assembly steps, reducing manufacturing costs and complexity.
3Reliability
If electronic components are added to packaging, then monitoring capability improves, but device complexity increases
Solution Approach 1:
The patent merges the sensor, transmitter, and power supply into a single integrated plastic element structure. This consolidation reduces the number of separate components and connection points, thereby reducing overall device complexity while maintaining reliable condition monitoring functionality.
Solution Approach 2:
The plastic element is designed to perform multiple functions simultaneously: providing structural integrity, housing electronic components, enabling wireless communication, and powering the system. This multi-functionality reduces the need for additional separate systems and simplifies the overall packaging design.
Data Source
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AI summary
Shown and described is a plastic element (1', 1'', 1''') for a package (14', 14''), comprising: a main body (1', 1'', 1''') of plastic, and a flange (4) for fastening a composite material of a package, wherein the plastic element (2) is produced from a thermoplastic material. In order in the case of single-use packages to create a low-cost possible way of obtaining information about the state of the content of the packages, it is proposed to arrange an electrical, in particular electronic element (15, 15') on the plastic element (1', 1'', 1''') or integrate it in the plastic element (1', 1'', 1'''). Also shown and described is a package (14', 14'') with such a plastic element (1', 1'', 1''').