Thermoresistive Micro Sensor With Through-Hole Conductive Structures
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Solution Overview
Problem
Current thermoresistive micro sensor devices face challenges in accurately measuring low mass flows and pressures due to limitations in sensitivity and response time, particularly in turbulent flows and acoustics applications.
Innovation Solution
A thermoresistive micro sensor device is designed with a semiconductor chip, through holes, electrically conductive structures, and an insulating arrangement, allowing for precise resistance measurement and enhanced sensitivity by optimizing heat transfer and fluid interaction, enabling accurate mass flow and pressure measurement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional thermal flow sensors are used, then basic flow measurement is achieved, but sensitivity and response time are insufficient for low mass flows and turbulent flows
Solution Approach 1:
The sensor device is segmented into functionally independent heating elements and sensing elements that can be separately optimized. The heating elements generate thermal energy while the sensing elements detect temperature changes, allowing independent design optimization for maximum sensitivity without increasing overall device complexity.
Solution Approach 2:
The patent transitions from conventional planar sensor layouts to a three-dimensional configuration where sensing elements are positioned at multiple heights above the heating elements. This vertical dimensionality enhancement allows capture of temperature gradients in the fluid flow, significantly improving sensitivity to low mass flows without complicating the device structure.
2Speed
If smaller sensor elements are used to increase speed, then response time improves, but manufacturing precision requirements increase
Solution Approach 1:
The sensor array is divided into multiple discrete sensing elements distributed in space. Each element can be manufactured using standard fabrication processes with relaxed precision requirements, while the collective array maintains high response speed through parallel operation and spatial distribution of measurement points.
Solution Approach 2:
Different regions of the sensor device have locally optimized characteristics. Elements closer to the heating source have different geometric properties than those farther away, allowing each region to be manufactured with appropriate precision tolerances while maintaining overall fast response performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves increased sensitivity and accuracy in detecting low mass flows and pressures, with improved response time and cost-effectiveness, suitable for applications like microreactors and medical devices, and can be integrated into MEMS systems.
Implementation Method 1
electrical energy, which is supplied to the contact arrangement, is fed to at least one of the electrically conductive structures in order to heat the respective electrically conductive structure
Implementation Method 2
an electrical resistance of one of the electrically conductive structures may be measured at the contact arrangement
Data Source
AI summary
A thermoresistive micro sensor device includes a semiconductor chip; a through hole, which runs through the semiconductor chip from an upper side to a lower side; electrically conductive structures, wherein the middle section of each of the electrically conductive structures spans over the through hole at the upper side of the semiconductor chip; an electrically insulating arrangement for electrically insulating the electrically conductive structures and the semiconductor chip from each other, wherein the through hole runs through the electrically insulating arrangement; and a contact arrangement including contacts, wherein each of the contacts is electrically connected to one of the first end sections or one of the second end sections, so that electrical energy is fed to at least one of the electrically conductive structures to heat the respective electrically conductive structure, and so that an electrical resistance of one of the electrically conductive structures is measured at the contact arrangement.