Thermosensitive Chip with Glass Protective Layers
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Solution Overview
Problem
Existing thermosensitive chips have slow response times and difficulty in controlling resistance value precision, particularly as they are miniaturized, leading to suboptimal performance in temperature detection and control applications.
Innovation Solution
A thermosensitive chip with alternately disposed glass protective layers and gold or silver metal electrode layers on a ceramic semiconductor substrate, manufactured through spray-coating, sintering, and precise slicing, allowing for quick response and high precision resistance measurement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thermosensitive chip size is reduced for miniaturization, then the chip can be mounted more efficiently on surfaces, but the resistance value precision becomes harder to control and test
Solution Approach 1:
The chip structure is segmented into alternating conductive regions (without glass protective layer) and non-conductive regions (with glass protective layer). This segmentation allows the conductive regions to provide precise resistance measurement paths while the non-conductive regions provide thermal isolation, enabling accurate testing even in miniaturized chips.
Solution Approach 2:
Different regions of the chip are given different properties: areas without glass protective layers have high thermal conductivity for sensing, while areas with glass protective layers have low thermal conductivity for isolation. This local differentiation of properties enables precise resistance control and measurement in small-sized chips.
2Volume of moving object
If the thermosensitive chip is made smaller for miniaturization, then surface mounting efficiency improves, but the response time increases
Solution Approach 1:
The chip is divided into sensing regions (conductive, without glass layer) and isolation regions (non-conductive, with glass layer). The segmented design ensures that heat quickly reaches the sensing regions for fast response while the isolation regions prevent heat dissipation to surrounding areas, maintaining quick response in miniaturized chips.
Solution Approach 2:
The chip exhibits local quality variations in thermal conductivity: high conductivity in conductive regions for rapid temperature sensing, and low conductivity in non-conductive regions for thermal isolation. This enables miniaturized chips to maintain fast response times.
3Ease of manufacture
If conventional printing methods are used for metal electrode layers, then the manufacturing process is simple, but the resistance value precision and reliability are insufficient
Solution Approach 1:
The glass protective layers are formed first through spray coating and sintering before the metal electrode layers are applied. This preliminary action creates a stable thermal and electrical foundation that enables precise resistance control in subsequent electrode formation steps, improving both precision and reliability.
Solution Approach 2:
The chip uses composite structure combining glass protective layers with metal electrode layers on ceramic substrate. This composite material approach provides both the reliability of glass protection and the precise electrical properties of metal electrodes, achieving high precision and reliability while maintaining manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables rapid temperature sensing and precise resistance value testing, enhancing the reliability and performance of thermosensitive chips by separating conductive and non-conductive regions and improving resistance measurement accuracy.
Implementation Method 1
glass protective layers are spray-coated and sintered alternately on the two surfaces of the thermosensitive ceramic semiconductor substrate
Implementation Method 2
the glass protective layers are spray-coated and sintered alternately
Implementation Method 3
the two surfaces of the thermosensitive ceramic semiconductor substrate having the glass protective layers are printed with metal electrode layers
Data Source
AI summary
A high precision high reliability and quick response thermosensitive chip and manufacturing method thereof is provided, including a thermosensitive ceramic semiconductor substrate; glass protective layers are alternately spray-coated and sintered on the two surfaces of the thermosensitive ceramic semiconductor substrate; and the two surfaces of the thermosensitive ceramic semiconductor substrate having the glass protective layers are printed with metal electrode layers. The thermosensitive chip achieves quick response, accurate control of resistance precision and has high precision; in addition, the glass protective layers thereof enable the thermosensitive chip to have high reliability.