Thermoset Resin Flow Model for PCB Lamination
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Solution Overview
Problem
The complex fluid flow properties of thermoset resins pose challenges in designing effective printed circuit board (PCB) lamination processes, particularly in ensuring adequate resin wetting and preventing issues like resin starvation and excess resin, due to the temperature-dependent viscosity changes during the curing process.
Innovation Solution
A method is developed to generate a thermoset resin flow model using stored rheology data and PCB laminate design information, allowing for the adjustment of lamination parameters to optimize resin flow, thereby reducing the likelihood of resin starvation and excess resin by iteratively modifying parameters based on the model predictions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermoset resin is used in PCB laminate design, then the resin provides structural integrity and electrical properties, but the temperature-dependent viscosity changes during curing make the fluid flow properties complex and difficult to control
Solution Approach 1:
The patent applies parameter changes by using temperature-dependent viscosity data and curing kinetics to dynamically adjust lamination process parameters. The system modifies pressure, temperature, and time parameters during the lamination process to account for the changing rheological properties of the thermoset resin as it cures, thereby controlling resin flow and distribution despite the complex viscosity changes.
Solution Approach 2:
The patent employs preliminary action by pre-calculating and pre-planning the lamination process parameters based on stored rheology data and curing kinetics. The system determines optimal pressure, temperature, and time profiles before the actual lamination process, allowing the complex resin flow behavior to be anticipated and controlled in advance rather than reacting to it during the process.
2Manufacturing precision
If lamination process parameters are adjusted to improve resin flow, then resin distribution is optimized, but the process design becomes more complex and requires iterative modifications
Solution Approach 1:
The patent implements feedback by using stored rheology data and curing kinetics to predict resin flow behavior, then comparing these predictions against desired outcomes to iteratively adjust lamination parameters. The system continuously refines the process design based on the changing viscosity and curing state of the resin, allowing for precise control of resin distribution through iterative parameter optimization.
Solution Approach 2:
The patent applies dynamics by making the lamination process parameters adaptive rather than static. The system dynamically adjusts pressure, temperature, and time profiles during the lamination process to match the real-time changing rheological properties of the thermoset resin. This dynamic approach allows the process to respond to and optimize resin flow conditions as they evolve during curing.
3Strength
If the viscosity of thermoset resin increases during curing, then the resin sets and gains strength, but resin flow is restricted and may cause resin starvation in certain regions
Solution Approach 1:
The patent uses preliminary action by pre-calculating the curing kinetics and viscosity evolution of the thermoset resin before the lamination process. The system determines the optimal timing and magnitude of pressure application, temperature profiles, and process duration in advance, ensuring that resin is supplied to all regions before the resin sets and viscosity increases to problematic levels.
Solution Approach 2:
The patent maintains continuity of useful action by keeping the lamination process parameters adjusted to match the continuous curing and viscosity change of the resin. The system continuously adapts pressure, temperature, and time parameters throughout the entire curing process, ensuring uninterrupted and adequate resin flow from the source to all circuit regions despite the increasing viscosity during curing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the design of PCB lamination processes by ensuring adequate resin wetting, reducing failures such as glistening filaments and resin starvation, and optimizing resin thickness, leading to more reliable and efficient PCB manufacturing.
Implementation Method 1
A thermoset material (e.g., a resin in a soft solid or viscous state) changes irreversibly into an infusible, insoluble polymer network by curing.
Implementation Method 2
a thermoset resin has a viscosity that varies as a function of temperature and reaction state (e.g., a degree of resin cross-linking). As a thermoset resin cures, the viscosity may initially decrease (provided that the curing is done at an elevated temperature) and then begin to rapidly increase as the thermoset resin begins to gel.
Data Source
AI summary
In an example, a method includes storing thermoset resin rheology data associated with a thermoset resin at a memory. The thermoset resin rheology data includes a plurality of sets of dynamic fluid flow properties that are measured for the thermoset resin. The method includes receiving, at a computing device, information associated with a printed circuit board (PCB) laminate design. The method also includes receiving, at the computing device, a first set of PCB lamination parameters. The method further includes storing, at the computing device, a first thermoset resin flow model. The first thermoset resin flow model is generated based on the thermoset resin rheology data, the information associated with the PCB laminate design, and the first set of PCB lamination parameters.