Thermosetting Adhesive Sheet for Semiconductor Wafer Dicing
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Solution Overview
Problem
Conventional thermosetting adhesive sheets used in semiconductor manufacturing to prevent cracks during dicing processes compromise laser mark visibility and alignment mark readability due to reduced transparency when coloring agents are added, leading to high defect rates and quality control issues.
Innovation Solution
A thermosetting adhesive sheet with a transparent filler having an average primary particle diameter of 1 to 1000 nm and a colorant, where the transparent filler constitutes 30 to 100 parts by mass and the colorant 0.5 to 3.0 parts by mass relative to 80 parts of the thermosetting binder, enhancing laser mark visibility and alignment mark readability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If a coloring agent is added to the thermosetting adhesive sheet to improve laser mark readability, then laser mark visibility is improved, but transparency is reduced and alignment mark readability deteriorates
Solution Approach 1:
The patent changes the particle size parameter of the transparent filler to 1-1000 nm range, which allows light to pass through more effectively while still providing the necessary contrast for laser mark readability. This parameter optimization resolves the contradiction between transparency and readability by finding the optimal particle size that satisfies both requirements simultaneously.
Solution Approach 2:
The patent creates a composite adhesive sheet containing both transparent filler (30-100 parts by mass) and colorant (0.5-3.0 parts by mass) in specific proportions. This composite structure allows the transparent filler to maintain overall transparency for alignment mark readability while the colorant provides sufficient contrast for laser mark visibility, thus resolving the contradiction between these two opposing requirements.
2Illumination intensity
If the content of transparent filler is increased to maintain transparency, then alignment mark readability is improved, but laser mark visibility may deteriorate
Solution Approach 1:
The patent optimizes the particle size parameter of the transparent filler to 1-1000 nm, which is small enough to allow light transmission for alignment mark readability but sufficient to provide scattering effects for laser mark visibility. This parameter optimization enables both functions to coexist without compromising either readability type.
Solution Approach 2:
The patent applies the concept of local quality by having different components serve different functions: the transparent filler (30-100 parts by mass) primarily maintains transparency and alignment mark readability, while the colorant (0.5-3.0 parts by mass) provides localized contrast enhancement for laser mark visibility. This functional differentiation allows both requirements to be satisfied simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves excellent laser mark visibility and alignment mark readability, reducing defect rates and improving the quality of semiconductor devices by maintaining transparency while providing necessary reinforcement to the semiconductor wafer.
Implementation Method 1
a transparent filler having an average primary particle diameter from 1 nm to 1000 nm
Implementation Method 2
transparent filler...content of the transparent filler is from 30 to 100 pts. mass with respect to 80 pts. mass of the thermosetting binder
Implementation Method 3
a colorant; wherein content of the colorant is from 0.5 to 3.0 pts. mass with respect to 80 pts. mass of the thermosetting binder...excellent laser mark visibility
Implementation Method 4
a thermosetting binder...a curing step of curing the thermosetting adhesive sheet
Data Source
AI summary
A thermosetting adhesive sheet comprises a thermosetting binder, a transparent filler having an average primary particle diameter from 1 nm to 1000 nm and a colorant; wherein content of the transparent filler is from 30 to 100 pts. mass with respect to 80 pts. mass of the thermosetting binder and content of the colorant is from 0.5 to 3.0 pts. mass with respect to 80 pts. mass of the thermosetting binder; this thermosetting adhesive sheet is applied to a grinding-side surface of a semiconductor wafer and before dicing the semiconductor wafer. Printing using laser marking is thus made clear enabling excellent laser mark visibility and accurate alignment using infrared light.