Thermosetting Adhesive Solder Paste for Component Mounting
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Solution Overview
Problem
Existing electronic component mounting methods using resin adhesives to reinforce solder junctions are complex, costly, and unreliable, especially for small components where space is limited, as they require additional processing steps and struggle to form effective reinforcement in tight gaps.
Innovation Solution
A method involving a thermosetting adhesive mixed with solder particles is applied to both the electrode and an adhesion reinforcing portion on the substrate, where the adhesive is heated to fuse and solidify, forming a solder junction and resin-reinforced parts that enhance the bonding between the component and substrate, eliminating the need for extra resin application steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If resin adhesive is supplied to reinforce solder junction, then junction strength is improved, but manufacturing process complexity increases and manufacturing cost increases
Solution Approach 1:
The patent combines the adhesive and solder particles into a single mixed material that is supplied together in one step. This merging eliminates the need for separate adhesive application and soldering steps, thereby improving junction strength while reducing manufacturing process complexity
Solution Approach 2:
The mixed material serves multiple functions simultaneously: it provides adhesive bonding, contains solder particles for electrical connection, and forms a reinforced junction structure. This multi-functionality eliminates the need for separate resin adhesive supply steps, reducing process complexity while maintaining strength enhancement
2Strength
If resin adhesive is supplied to reinforce solder junction, then junction strength is improved, but manufacturing cost increases
Solution Approach 1:
By combining adhesive and solder particles into one supplied material, the patent eliminates the need for separate resin adhesive materials and application equipment, reducing manufacturing cost while maintaining junction strength improvement
Solution Approach 2:
The mixed material performs multiple functions (adhesion, electrical connection, reinforcement) in a single supply operation, eliminating the need for separate resin adhesive materials and reducing overall manufacturing cost
3Strength
If resin adhesive is applied around electronic component after mounting, then junction reinforcement is attempted, but adequate reinforcement cannot be formed in small gaps
Solution Approach 1:
The adhesive and solder particles are supplied together before component mounting, allowing the mixed material to be precisely positioned in advance. This preliminary action ensures adequate reinforcement in small gaps without requiring precise post-mounting application
Solution Approach 2:
By supplying adhesive and solder particles together as a mixed material before mounting, the patent achieves precise placement in small gaps, eliminating the difficulty of post-mounting adhesive application in tight spaces
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces costs, and ensures reliable reinforcement by forming a robust solder junction and adhesion-reinforced parts that enhance the mechanical strength and reliability of the electronic component mounting, particularly suitable for small components in portable appliances.
Implementation Method 1
a heating step of heating the substrate after the component mounting step, in which the adhesive supplying step is characterized by supplying the adhesive to the electrode
Implementation Method 2
forming a solder junction by bonding the connection terminal and electrode by fusing the solder particles in the adhesive supplied to the electrode
Implementation Method 3
bonding the connection terminal and electrode by fusing the solder particles in the adhesive supplied to the electrode
Implementation Method 4
forming a solder junction by bonding the connection terminal and electrode by fusing the solder particles
Implementation Method 5
forming an adhesion reinforced part for fixing the electronic component to the substrate by heating and curing the adhesive
Implementation Method 6
fixing the electronic component to the substrate by heating and curing the adhesive
Data Source
AI summary
In order to mount an electronic component, a connection terminal of the electronic component is bonded to electrodes of a substrate. This is done by using solder paste which mixes solder particles in a thermosetting adhesive. The solder paste is supplied to the electrodes and a recess. Solder print parts are formed. The electronic component is mounted and the connection terminal and the main body of the electronic component are adhered to the solder print parts, and are heated in this state by reflow. As a result, the connection terminal and the electrodes are bonded by a solder junction.