Thermosetting Buffer Sheet Composition for Precise Component Mounting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for collectively mounting multiple electronic components on substrates face issues of positional deviation and uneven load distribution, leading to potential connection failures and reduced reliability due to thermal expansion and deformation of components.
Innovation Solution
A buffer sheet composed of a thermosetting compound, optionally including polymerization initiators, thermoplastic resin, inorganic fillers, and curing agents, is interposed between the heating member and electronic components to reduce thermal expansion and uneven load distribution, ensuring precise alignment and reliable connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple electronic components are collectively mounted on substrates using existing methods, then productivity is improved, but manufacturing precision deteriorates due to positional deviation and uneven load distribution
Solution Approach 1:
A buffer sheet is introduced as an intermediary layer between the heating member and the electronic components. This buffer sheet uniformly distributes the load during heating and pressing operations, preventing uneven deformation and positional deviation of multiple components mounted on substrates, thereby maintaining high manufacturing precision while enabling collective production
2Reliability
If heating is applied to mount electronic components on substrates, then connection reliability is improved, but manufacturing precision deteriorates due to thermal expansion and deformation
Solution Approach 1:
The buffer sheet is designed with specific thermal and mechanical properties that allow it to control and uniformize the thermal expansion and deformation characteristics during the heating process. By changing the physical parameters of the interface layer (buffer sheet), the system achieves both reliable heating for connection and minimal positional deviation
3Ease of operation
If a thermoplastic anti-fouling sheet is used to prevent underfill material from seeping out, then ease of operation is improved, but manufacturing precision deteriorates due to thermal expansion and deformation
Solution Approach 1:
The buffer sheet serves multiple functions simultaneously: it acts as an anti-fouling barrier to prevent underfill material from seeping out during the TCB process, while also functioning as a load-distributing layer that uniformizes thermal expansion and deformation. This multi-functionality eliminates the need for separate anti-fouling sheets and maintains manufacturing precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The buffer sheet effectively reduces positional deviation and uneven load distribution, enabling reliable and efficient collective production of multiple electronic component devices with improved connectivity and reduced failure rates.
Implementation Method 1
a buffer sheet composed of a thermosetting compound, optionally including polymerization initiators
Implementation Method 2
it becomes possible to reduce the positional deviation resulting from a difference in the thermal expansion
Data Source
Figure 1A
Figure 1B
Figure 1C
AI summary
The present invention provides a buffer sheet composition including a thermosetting compound, which buffer sheet composition is used for producing a buffer sheet to be interposed between a heating member and an electronic component, when the electronic component is heated by the heating member so as to mount the electronic component on a substrate, as well as a buffer sheet including a thermosetting composition layer obtained by forming the buffer sheet composition into the form of a sheet.