Thermosetting Composition for Electronic Sealing

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Solution Overview

Problem

Current thermosetting materials used for sealing electronic components lack productivity and are not suitable for three-dimensional objects, as they require photolithography and can erode electrical circuits during dipping processes, and existing molding methods are inefficient.

Innovation Solution

A thermosetting composition comprising specific compounds, thermal polymerization initiators, and inorganic fillers, with controlled viscosity and additives, is used for injection molding under controlled pressure and temperature conditions to produce a cured product with improved waterproofness, water vapor barrier properties, and flame retardance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If spin coating is used to apply thermosetting resin, then the resin can be applied to circuit boards, but photolithography process is required which reduces productivity

Engineering Contradiction:

Improveease of applicationVSAvoidproductivity

Core Design Contradiction:

Ease of manufactureVSProductivity

Solution Approach 1:

The invention extracts and removes the photolithography process step from the manufacturing workflow by using a thermosetting resin composition that cures thermally without requiring light-sensitive initiators, thereby eliminating the need for photolithography while maintaining application capability

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The invention replaces the photochemical curing mechanism (photopolymerization requiring photolithography) with a thermal curing mechanism (thermal polymerization), substituting the optical field-based system with a thermal field-based system to eliminate the photolithography step

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Ease of manufacture

If dipping method is used to apply thermosetting resin, then coating can be achieved, but solvents erode electrical circuits reducing reliability

Engineering Contradiction:

Improveease of coatingVSAvoidreliability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The invention changes the physical parameter of the resin composition by formulating it with controlled viscosity (0.001-80 Pa·s at 25°C) and appropriate solid content, enabling the resin to be applied in a solvent-free or low-solvent state that eliminates circuit erosion while maintaining coating capability

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention converts the potential harm of solvent-based application (circuit erosion) into a benefit by developing a formulation that achieves effective coating without harmful solvents, using the resin's inherent flow properties and thermal curing characteristics to deliver the coating function safely

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Reliability

If conventional thermosetting materials are used for sealing, then sealing function is provided, but productivity is very poor

Engineering Contradiction:

Improvesealing functionVSAvoidproductivity

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The invention changes key parameters of the thermosetting composition including viscosity (0.001-80 Pa·s), solid content (5-50%), and curing characteristics to enable both effective sealing and high productivity through faster curing and simpler processing

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention creates a multi-functional resin composition that simultaneously provides sealing protection, electrical insulation, and structural support while enabling high-productivity manufacturing through thermal curing, consolidating multiple functions into a single material system

Inventive Principle:

Principle #6Universality (Multi-functionality)

4Productivity

If injection molding is used to produce molded articles, then productivity and moldability are improved, but control of curing process and prevention of defects require optimized composition

Engineering Contradiction:

ImproveproductivityVSAvoidcuring control

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The invention optimizes composition parameters including viscosity (0.001-80 Pa·s), solid content (5-50%), and molecular weight to enable proper injection molding flow while controlling curing characteristics to prevent defects and ensure manufacturing precision

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention incorporates a thermal polymerization initiator system that responds to temperature changes during injection molding, providing feedback-controlled curing that adapts to the molding process conditions to prevent defects while maintaining high productivity

Inventive Principle:

Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances productivity and moldability, producing a cured product with excellent sealing properties, reduced curing time, and improved reliability against moisture and foreign objects, while preventing burrs and warpage.

Implementation Method 1

a thermal polymerization initiator

Methodology Applied

Scientific EffectThermal polymerization: Photopolymerisation

Data Source

PatentUS20240368322A1Thermosetting composition, method for producing molded article using the same, and cured product

Publication Date: 2024.11.07 IDEMITSU KOSAN CO LTD

AI summary

A thermosetting composition comprising: (A) a compound represented by the formula (A2) or (A3), (B) a thermal polymerization initiator, and (E) an inorganic filler.