Thermosetting Conductive Adhesive for Fast High-Temperature Curing
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Solution Overview
Problem
Existing thermosetting conductive adhesives require multiple curing steps and high temperature for extended periods, leading to decreased conductivity and adhesive strength, especially when used with nickel-coated adherends, which often exhibit high resistance or insufficient adhesive force.
Innovation Solution
A thermosetting conductive adhesive composition comprising a urethane-modified polyfunctional (meth)acrylate oligomer, a monofunctional (meth)acrylate monomer, an organic peroxide, and conductive particles, which allows for high conductivity and adhesive strength when cured at high temperatures in a short time, specifically using aromatic or aliphatic urethane-modified acrylate oligomers and surface-treated conductive particles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple curing steps (light irradiation and thermosetting) are used to achieve proper curing, then the adhesive reaches final cured state, but the curing time becomes excessively long
Solution Approach 1:
The patent combines the photocuring function (using (meth)acrylate resin) and thermosetting function (using epoxy resin) into a single dual-curable adhesive system. This allows the adhesive to be cured by either light irradiation alone, heat treatment alone, or a combination of both, eliminating the need for separate sequential curing steps and significantly reducing total curing time while ensuring complete curing.
2Productivity
If high temperature curing (110°C to 130°C) is applied for short time to reduce curing duration, then productivity increases, but conductivity and adhesive force decrease
Solution Approach 1:
The patent uses a composite resin system combining (meth)acrylate resin and epoxy resin, along with conductive particles, to create an adhesive that maintains high conductivity and adhesive strength even when cured at high temperatures for short durations. The conductive particles are specifically surface-treated to ensure they maintain their conductive properties under rapid high-temperature curing conditions.
3Stability of the object's composition
If conventional thermosetting conductive adhesive is used with nickel-coated adherends, then price and surface stability are improved, but connection resistance increases and adhesive force becomes insufficient
Solution Approach 1:
The patent modifies the chemical composition parameters of the adhesive by incorporating specific (meth)acrylate resin and epoxy resin combinations, along with surface-treated conductive particles. These compositional changes enable the adhesive to chemically bond effectively with nickel-coated surfaces, reducing connection resistance and improving adhesive strength while maintaining the benefits of nickel plating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive achieves low connection resistance and excellent adhesive strength to nickel-coated adherends when cured at temperatures between 80°C to 150°C within 1 to 15 minutes, ensuring reliable conductivity and bonding.
Implementation Method 1
component (C): an organic peroxide
Implementation Method 2
component (D) and its content: 50 to 1000 parts by mass of the component (D) relative to 100 parts by mass of the total of the component (A) and the component (B)
Data Source
AI summary
A thermosetting conductive adhesive that can exhibit high conductivity (low connection resistance) when cured at a high temperature in a short time. The present invention also provides a thermosetting conductive adhesive that has excellent adhesive strength when cured at a high temperature in a short time. The thermosetting conductive adhesive according to the present invention includes components (A) to (D): component (A): a urethane-modified polyfunctional (meth)acrylate oligomer that is either an aromatic urethane-modified (meth)acrylate oligomer having six (meth)acryl groups in the molecule or an aliphatic urethane-modified (meth)acrylate oligomer having two (meth)acryl groups in the molecule; component (B): a monofunctional (meth)acrylate monomer; component (C): an organic peroxide; and component (D): conductive particles, in which when the component (A) is an aliphatic urethane-modified (meth)acrylate oligomer having two (meth)acryl groups in the molecule, the component (B) is a monofunctional acrylate monomer.