Thermosetting LDS Resin Composition for Stable 3D Circuit Plating
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Solution Overview
Problem
Thermosetting resin compositions for laser direct structuring (LDS) have not been sufficiently investigated, leading to suboptimal plating deposit characteristics compared to thermoplastic resins.
Innovation Solution
A thermosetting resin composition for LDS, comprising a thermosetting resin, an inorganic filler, a non-conductive metal compound that forms a metal nucleus upon active energy ray irradiation, and a coupling agent, with specific components such as spinel-type metal oxides, transition metal oxides, and silane-based coupling agents, to enhance plating deposit characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermosetting resin is used for LDS instead of thermoplastic resin, then thermal stability and moisture resistance are improved, but plating deposit characteristics deteriorate
Solution Approach 1:
The patent changes the chemical composition parameters of the thermosetting resin by incorporating specific non-conductive metal compounds (spinel-type metal oxides, transition metal oxides, tin-containing oxides) and coupling agents (mercaptosilane, aminosilane, epoxysilane) to modify the resin's surface properties and improve plating deposit characteristics while maintaining thermal stability and moisture resistance
Solution Approach 2:
The patent creates a composite thermosetting resin composition by combining the base thermosetting resin with inorganic fillers, non-conductive metal compounds, and coupling agents. This composite structure enables the material to simultaneously achieve good plating deposit characteristics and maintained thermal/moisture resistance properties
2Manufacturing precision
If non-conductive metal compound content is increased to improve plating deposit characteristics, then plating quality improves, but resin composition complexity increases
Solution Approach 1:
The patent optimizes the content parameters of non-conductive metal compounds within specific ranges (spinel-type metal oxide: 0.1-5 wt%, transition metal oxide: 0.1-5 wt%, tin-containing oxide: 0.1-5 wt%) to achieve good plating deposit characteristics while controlling composition complexity. The coupling agent content is also controlled within 0.1-5 wt% to balance performance and complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition improves plating deposit characteristics in cured products, enabling the formation of high-quality plated patterns and circuits, while maintaining moisture resistance and thermal stability.
Implementation Method 1
a non-conductive metal compound that forms a metal nucleus upon irradiation with active energy rays
Data Source
AI summary
The thermosetting resin composition for LDS of the invention includes a thermosetting resin, an inorganic filler, a non-conductive metal compound that forms a metal nucleus upon irradiation with active energy rays, and a coupling agent, in which the non-conductive metal compound includes one or more selected from the group consisting of a spinel-type metal oxide, a metal oxide having two or more transition metal elements in groups adjacent to each other, the groups being selected from groups 3 to 12 of the periodic table, and a tin-containing oxide, and the coupling agent includes one or more selected from the group consisting of mercaptosilane, aminosilane, and epoxysilane.