Thermosetting Resin Composition for High-Temperature Power Modules
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Solution Overview
Problem
Existing thermosetting resin compositions for heat-dissipating members in power modules have limitations in heat dissipation and insulation properties, particularly in high-temperature environments, which affect the reliability and performance of power modules installed near turbines.
Innovation Solution
A thermosetting resin composition with an epoxy resin and thermally conductive particles, specifically boron nitride, is developed, achieving a thermal conductivity of 12 W/(m·K) or higher at 200°C and a volume resistivity of 1.0×10^10 Ω·m or higher, enhancing heat dissipation and insulation properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional thermosetting resin compositions are used for heat-dissipating members in power modules, then manufacturing is simpler, but heat dissipation performance and insulation properties are insufficient in high-temperature environments
Solution Approach 1:
The patent employs composite materials by combining epoxy resin with thermally conductive particles (such as boron nitride, aluminum oxide, or aluminum nitride) to create a resin composition that achieves high thermal conductivity (12 W/(m·K) or higher at 200°C) while maintaining electrical insulation properties. This composite approach resolves the contradiction by integrating multiple functional materials to simultaneously improve heat dissipation and insulation performance.
Solution Approach 2:
The patent applies parameter changes by optimizing the thermal conductivity parameter to be 12 W/(m·K) or higher at 200°C, which is a significant improvement over conventional resin compositions. This parameter optimization is achieved through careful selection and proportioning of thermally conductive particles, thereby enhancing reliability without excessively complicating the composition formulation.
2Temperature
If thermally conductive filler is added to improve heat dissipation, then thermal conductivity increases, but insulation properties may deteriorate
Solution Approach 1:
The patent applies local quality by selecting specific types of thermally conductive particles (such as boron nitride, aluminum oxide, or aluminum nitride) that provide high thermal conductivity while maintaining electrical insulation properties. The particles are distributed throughout the epoxy resin matrix to create localized thermal conduction pathways while preserving the overall electrical insulation of the composition.
Solution Approach 2:
The composite material approach combines the electrical insulation properties of epoxy resin with the high thermal conductivity of selected particulate fillers, creating a material that simultaneously achieves both thermal conduction and electrical insulation functions, thereby resolving the contradiction between these two properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively improves heat dissipation and insulation in high-temperature environments, reducing leakage current and preventing short circuits, thus enhancing the reliability of power modules.
Implementation Method 1
a thermal conductivity λ200 at 200° C. of a cured product obtained by heating the thermosetting resin composition at 200° C. for 90 minutes is 12 W/(m·K) or higher
Data Source
AI summary
Provided is a thermosetting resin composition including an epoxy resin and thermally conductive particles. A thermal conductivity λ200 at 200° C. of a cured product obtained by heating the thermosetting resin composition at 200° C. for 90 minutes is 12 W/(m·K) or higher. In addition, a volume resistivity R200 of the cured product at 200° C. is preferably 1.0×1010 Ω·m or more. In addition, a resin sheet using this thermosetting resin composition is provided. Furthermore, a metal base substrate using this thermosetting resin composition is provided.