Thermosetting Resin Composition for Optical Semiconductor Encapsulation
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Solution Overview
Problem
Conventional thermosetting resin compositions for optical semiconductors fail to achieve optimal heat resistance, light resistance, adhesion, and mechanical properties, often resulting in low stress and high cure shrinkage, which leads to degradation and peeling issues.
Innovation Solution
A thermosetting resin composition containing organopolysiloxane compounds with specific chemical structures and a cationic polymerization catalyst, along with acid anhydrides and accelerators, is used to create a low-stress, high-adhesion, and low-cure-shrinkage material suitable for optical semiconductor sealing and die bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional epoxy resin compositions are used, then transparency is maintained, but heat resistance, light resistance, adhesion, and mechanical properties are insufficient
Solution Approach 1:
The patent uses a composite resin system combining organopolysiloxane (silicone) with epoxy resin. The organopolysiloxane component provides superior heat resistance, light resistance, and flexibility, while the epoxy resin contributes to adhesion and mechanical strength. This composite approach allows simultaneous achievement of high reliability and good manufacturability that neither material can achieve alone.
Solution Approach 2:
The patent modifies the chemical composition parameters by introducing specific organopolysiloxane structures with siloxane bonds (Si-O-Si) which have higher bond energy and thermal stability compared to conventional epoxy structures. This parameter change in molecular structure enables improved heat resistance and light resistance while maintaining adhesion properties.
2Stress or pressure
If amino group-containing silicone is added to reduce stress, then heat resistance is maintained, but adhesion deteriorates and peeling occurs
Solution Approach 1:
The patent applies local quality by incorporating flexibility-enhancing components (organopolysiloxane) at specific proportions (5-50 mass%) within the resin system, rather than uniformly throughout. This localized modification reduces cure shrinkage stress in critical areas while maintaining adhesion strength in bonding interfaces, preventing peeling without sacrificing overall structural integrity.
3Stress or pressure
If spherical silica is added to reduce stress, then heat resistance is improved, but adhesion deteriorates and peeling occurs
Solution Approach 1:
The patent changes the physical-chemical parameters by selecting organopolysiloxane with specific molecular weight ranges (1,000-1,000,000) and siloxane bond densities. This parameter optimization allows the material to achieve stress reduction through molecular flexibility while maintaining adhesion, avoiding the peeling issues associated with spherical silica addition.
4Ease of manufacture
If conventional organic resin structures are used, then ease of manufacture is maintained, but thermal shock resistance and adhesion are insufficient
Solution Approach 1:
The patent creates a composite system where organopolysiloxane (5-50 mass%) provides thermal shock resistance through its flexible siloxane backbone that can accommodate thermal expansion differences, while the epoxy resin matrix maintains ease of manufacture and processing. This composite structure achieves high reliability without sacrificing manufacturability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition provides excellent adhesion, heat resistance, light resistance, and mechanical properties, such as thermal shock resistance, while maintaining transparency and low viscosity, making it suitable for optical semiconductor applications.
Implementation Method 1
containing (A) a compound represented by following general formula (1) and/or a compound represented by general formula (2)... and (D) 0.001 to 10 parts by weight of a thermosetting cationic polymerisation catalyst
Data Source
AI summary
A thermosetting resin compositing having an essential component (A) organopolysiloxane containing a compound represented by following general formula a (1) or (2) and optical semiconductor peripheral material using the composition. [Herein, in the formulas, R1 independently represents a substituted or non-substituted monovalent hydrocarbon radical with the carbon number of 1 to 10, R2 represents an epoxy group-containing organic group, R3 represents R1 or R2, a independently represents an integer of 2 or more, b independently represents an integer of 0 or more, X represents general formula (3), Y represents -o- or a bivalent hydrocarbon radical with the carbon number of 1 to 6, Z represents following formula (4), R1 in the formula independently represents a substituted or non-substituted monovalent hydrocarbon radical with the carbon number of 1 to 10, and c represents an integer of 0 or more.]