Thermosetting Resin for PCB Dimensional Stability
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Solution Overview
Problem
Conventional printed circuit boards using fluorine-based polymer resins have low dimensional stability and poor impregnation characteristics, leading to reliability issues during manufacturing, and thermoplastic fluorinated polymer resins deform during laminating processes.
Innovation Solution
A thermosetting composition comprising a liquid crystal oligomer, a bismaleimide-based compound, and a fluorinated polymer resin powder is developed, which provides excellent heat resistance, impregnation characteristics, and low dielectric properties, improving dimensional stability and workability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If fluorine-based polymer resins are used for printed circuit boards, then low dielectric properties are achieved, but dimensional stability and impregnation characteristics deteriorate
Solution Approach 1:
The patent uses a composite resin system combining fluorinated polymer resin (for low dielectric properties) with thermosetting resins such as bismaleimide and epoxy. This composite approach allows the material to achieve both low dielectric constant and improved dimensional stability through the crosslinking network formed by thermosetting components, resolving the contradiction between electrical insulation and dimensional stability.
Solution Approach 2:
The patent modifies the physical and chemical parameters of the resin composition by controlling the molecular weight, glass transition temperature, and crosslinking density of the thermosetting components. By adjusting these parameters, the material achieves optimal balance between low dielectric properties and dimensional stability under operating conditions.
2Reliability
If fluorinated polymer resins are used for printed circuit boards, then low dielectric properties are achieved, but impregnation characteristics deteriorate
Solution Approach 1:
The patent combines fluorinated polymer resin with thermosetting resins having good impregnation characteristics. The thermosetting components facilitate effective impregnation of the resin into the substrate during manufacturing, while the fluorinated component provides the required low dielectric properties, thus resolving the contradiction between electrical insulation and ease of manufacture.
3Reliability
If thermoplastic fluorinated polymer resins are used, then low dielectric properties are achieved, but dimensional stability during laminating deteriorates
Solution Approach 1:
The patent changes the thermal and mechanical parameters of the resin system by incorporating thermosetting components with high glass transition temperatures and crosslinking tendencies. This parameter modification ensures dimensional stability during the laminating process while maintaining the low dielectric properties provided by the fluorinated polymer, resolving the contradiction between electrical insulation and stability during manufacturing.
Data Source
AI summary
Disclosed are a thermosetting composition including a liquid crystal oligomer, a bismaleimide-based compound, an epoxy compound, and a fluorinated polymer resin powder. A resin cured product, board, and storage medium each include the thermosetting composition.