Thermosetting Resin Composition for Semiconductor Packages
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge is to develop a thermosetting resin composition for semiconductor packages that maintains high stiffness and adhesion strength to metal foils while ensuring excellent flowability, especially when using high filler content, as increasing filler content typically deteriorates adhesion strength and flowability.
Innovation Solution
A thermosetting resin composition comprising 100 parts by weight of a binder resin including epoxy resin, bismaleimide resin, diaminodiphenylsulfone resin, and benzoxazine resin, combined with 350 parts by weight or more of three kinds of fillers with different average particle diameters, specifically a first filler of 0.7 μm to 1 μm, a second filler of 90 nm to 0.3 μm, and a third filler of 10 nm to 50 nm, to achieve improved stiffness and flowability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the content of filler such as silica is increased to increase the modulus, then the stiffness is improved, but the adhesion strength to copper foil decreases and the flowability deteriorates
Solution Approach 1:
The patent changes the particle size parameters of fillers by introducing a specific distribution (0.5-2.0 μm, 0.1-0.5 μm, and 10-100 nm ranges) to optimize both adhesion strength and flowability while maintaining high filler content for improved modulus
Solution Approach 2:
The patent uses a composite filler system combining three different particle size ranges of silica and alumina, creating a multi-scale composite structure that simultaneously improves adhesion, flowability, and stiffness properties
2Volume of moving object
If the content of filler such as silica is increased to increase the modulus, then the stiffness is improved, but the flowability deteriorates
Solution Approach 1:
The patent optimizes particle size parameters by introducing a specific distribution (0.5-2.0 μm, 0.1-0.5 μm, and 10-100 nm ranges) that maintains excellent flowability even with high filler content of 350 parts by weight or more, while achieving the desired modulus improvement
3Strength
If high filler content is used to achieve high stiffness, then the modulus is improved, but the flowability deteriorates
Solution Approach 1:
The patent optimizes particle size parameters by introducing a specific distribution (0.5-2.0 μm, 0.1-0.5 μm, and 10-100 nm ranges) that enables high filler content of 350 parts by weight or more to be used while maintaining excellent flowability for proper resin impregnation and lamination
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves high stiffness and excellent adhesion strength to metal foils while maintaining excellent flowability, even with high filler content, thereby enhancing the driving performance of thin electronic devices such as printed circuit boards.
Implementation Method 1
high crosslinking density of a resin system and thus ensuring excellent stiffness
Implementation Method 2
350 parts by weight or more of at least three kinds of fillers having different average particle diameters, wherein the filler includes a first filler having an average particle diameter of 0.7 μm to 1 μm, a second filler having an average particle diameter of 90 nm to 0.3 μm, and a third filler having an average particle diameter of 10 nm to 50 nm
Implementation Method 3
exhibiting excellent adhesion strength to a metal foil
Data Source
AI summary
A thermosetting resin composition having improved flowability and stiffness, and a prepreg using the same. Specifically, three kinds of fillers having different average particle diameters are combined with a binder resin system including an epoxy resin, a bismaleimide resin, a diaminodiphenylsulfone resin, and a benzoxazine resin.