Thermosetting Resin Composition for Void Suppression in Semiconductor Underfill
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Solution Overview
Problem
The thermal compression bonding technique faces challenges in suppressing void formation and ensuring favorable solder connectivity due to the difficulty in controlling the viscosity of underfill materials during rapid temperature increases, which are typical in semiconductor chip mounting processes.
Innovation Solution
A thermosetting resin composition comprising a phenol novolac-type epoxy resin, (meth)acrylate compounds, and a fluxing agent, designed to exhibit a specific viscosity behavior when heated at rates similar to those used in semiconductor chip mounting, is developed. This composition includes a film forming agent and specific ratios of curing agents, elastomers, fillers, and coupling agents to achieve optimal viscosity profiles, and a method for predicting viscosity behavior using the Kamal and Castro-Macosko models is employed to determine the ideal temperature and rate of temperature change for effective solder connectivity and void suppression.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the viscosity of the underfill is excessively low during thermocompression bonding, then solder connectivity is improved, but void formation increases due to outgas generation
Solution Approach 1:
The patent applies parameter changes by carefully controlling the viscosity of the underfill material through compositional adjustments (resin type, molecular weight, additives) to achieve optimal values within a specific range that simultaneously enables good solder connectivity and suppresses void formation during thermocompression bonding
Solution Approach 2:
The patent uses composite materials by formulating the underfill as a complex composition containing epoxy resin, phenolic resin, glass fibers, and various additives in specific ratios, where each component contributes to achieving the target viscosity and suppressing both void formation and solder connectivity issues
2Object-affected harmful factors
If the viscosity of the underfill is excessively high during thermocompression bonding, then void formation is suppressed, but solder connectivity deteriorates
Solution Approach 1:
The patent applies parameter changes by precisely adjusting the viscosity parameter within an optimal range through control of resin composition, molecular weight distribution, and additive content, enabling the underfill to maintain appropriate flow characteristics for solder connectivity while suppressing void formation
3Productivity
If the heating rate is increased for efficient semiconductor chip mounting, then productivity is improved, but viscosity control becomes difficult leading to void formation
Solution Approach 1:
The patent applies parameter changes by optimizing the underfill's viscosity-temperature characteristics through compositional design, enabling the material to maintain appropriate viscosity even under rapid heating conditions (high dT/dt) typical of efficient semiconductor chip mounting processes, thereby suppressing void formation while maintaining productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution enables the achievement of favorable solder connectivity while effectively suppressing void formation under the high heating conditions required in semiconductor chip thermocompression bonding, by precisely controlling the viscosity of the underfill material, thus improving the reliability of the thermal compression bonding technique.
Implementation Method 1
a first curing step of heating the thermosetting resin composition to perform a curing reaction
Implementation Method 2
the temperature at which the rate of temperature change of viscosity when temperature is increased according to a prescribed heating profile reaches 30 Pa·s/° C. is 200° C. to 250° C.
Data Source
AI summary
Provided is a thermosetting resin composition, which can be used as underfill for obtaining favorable solder connectivity while suppressing the formation of voids in the case of treating under heating conditions required by the underfill in a semiconductor chip thermocompression bonding step using the thermal compression bonding technique. The thermosetting resin composition contains a thermosetting resin, a curing agent and a fluxing agent, and the temperature at which the rate of temperature change of viscosity when temperature is increased according to a prescribed heating profile reaches 30 Pa·s/° C. is 200° C. to 250° C.