Thermosiphon Cooler Modules for Power Converter Heat Management
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Solution Overview
Problem
Existing cooling systems for electric and electronic components in power converter cabinets face inefficiencies in heat removal, particularly due to high power densities and the need for compact, flexible, and economically viable solutions that can effectively manage cooling air flow without compromising compactness or increasing pressure drop.
Innovation Solution
The implementation of a power converter cabinet with at least two modules, each equipped with a thermosiphon cooler that utilizes a two-phase cooling system with a loop-type thermosiphon, where the evaporator and condenser are arranged to maximize airflow efficiency and compactness, allowing for efficient heat transfer from IGBT modules and capacitors to ambient air through a guided cooling air flow path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air cooling systems with fans and fin arrays are used to cool electric and electronic devices, then heat removal capability is improved, but device complexity and pressure drop increase
Solution Approach 1:
The invention extracts the cooling function from a centralized fan-and-fin system and distributes it to individual modules. Each module contains its own heat dissipation structure, eliminating the need for complex centralized cooling infrastructure while maintaining effective heat removal from power electronic devices.
Solution Approach 2:
The cooling system is segmented into modular units, where each module has dedicated cooling elements. This segmentation allows independent optimization of each module's thermal management without affecting the entire system, reducing overall complexity while improving heat removal efficiency.
2Power
If multiple modules are arranged in parallel to increase current rating, then power handling capability is improved, but cooling air flow management becomes more difficult
Solution Approach 1:
Each module is designed with universal cooling characteristics, allowing identical cooling structures to be replicated across multiple parallel modules. The standardized design enables scalable power handling while maintaining consistent and simple air flow management across all modules.
Solution Approach 2:
The invention implements localized cooling solutions at each module level rather than attempting to manage air flow across the entire parallel arrangement. Each module's cooling structure is optimized for its specific location and thermal loads, simplifying overall air flow management while enabling high current ratings through parallel configuration.
3Volume of moving object
If compact module design is implemented to reduce form factor, then space utilization is improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The cooling structures are nested within the module housing, with heat dissipation elements integrated into the module's internal volume. This nesting approach maximizes heat dissipation surface area within the compact form factor, maintaining efficient thermal management while minimizing the module's external dimensions.
Solution Approach 2:
The invention utilizes vertical dimension for heat dissipation by arranging cooling elements in the height direction of the module. This dimensional approach allows effective heat removal without increasing the module's footprint area, achieving compact design while maintaining heat dissipation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances cooling efficiency, reduces pressure drop, and allows for a compact and flexible design that can scale power without increasing the module's form factor, effectively managing heat removal and maintaining high compactness within the cabinet.
Implementation Method 1
a two-phase cooling system with a loop-type thermosiphon, where the evaporator and condenser are arranged to maximize airflow efficiency and compactness, allowing for efficient heat transfer from IGBT modules and capacitors to ambient air
Implementation Method 2
each equipped with a thermosiphon cooler that utilizes a two-phase cooling system with a loop-type thermosiphon
Implementation Method 3
allowing for efficient heat transfer from IGBT modules and capacitors to ambient air through a guided cooling air flow path
Implementation Method 4
The cabinet further comprises at least two modules, each module comprising a guiding structure with an inlet and an outlet. The at least two modules are arranged in the cabinet housing such that a major portion of cooling air flowing through the first aperture of said cabinet housing is divided into partial streams of cooling air, at least some of the partial streams being enabled by the guiding structure to flow into each module via the inlet
Implementation Method 5
which thermosiphon cooler comprises a condenser for transferring a majority of said first heat load to said cooling air in an operating state of the cabinet
Data Source
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AI summary
The present invention relates to the cooling of electric and/or electronic components, in particular to an electric and/or electronic system (200) with a cabinet (400), which comprises a cabinet housing (406) comprising a first aperture for receiving a stream of cooling air. The cabinet housing (406) comprises a second aperture for releasing the cooling air thereafter in an operating state of the cabinet. At least two modules (102), each comprising a guiding structure with an inlet and an outlet are provided in the cabinet. The at least two modules (102) are arranged in the cabinet housing (406) such that a branch of the major portion of cooling air flowing through the first aperture of said cabinet housing (406) is enabled to flow into each module (102) via the inlet guided by the guiding structure through the dedicated module (102) to the outlet and thereafter through the second aperture out of the cabinet housing (406).