Thermosiphon Condenser and Evaporator Layout for Server Rack Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Thermosiphon systems face challenges in efficiently removing heat from electronic devices in server rack environments due to limited space and inadequate cooling, which can lead to device failure from overheating.
Innovation Solution
The design incorporates a thermosiphon system with a condenser having multiple vertical chambers without a top header, undulations on internal surfaces, and a flow restrictor in the evaporator to reduce thermal resistance, allowing for efficient heat transfer and operation within the limited space of a server rack.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a traditional thermosiphon system is used, then heat can be removed from electronic devices, but the system requires significant vertical space due to the top header structure
Solution Approach 1:
The patent removes the top header structure from the condenser, extracting the problematic component that consumed vertical space. The condenser chambers are configured to terminate without requiring a top header, thereby reducing the vertical footprint while maintaining heat removal functionality through alternative structural arrangements.
Solution Approach 2:
The patent redistributes the condenser chambers in a horizontal arrangement rather than requiring vertical stacking with a top header. By configuring multiple chambers side-by-side without a connecting top header, the system transitions from a vertically-dominated structure to a horizontally-oriented one, effectively utilizing available space in server rack environments.
2Area of moving object
If the evaporator uses a thick layer of liquid, then heat transfer area is increased, but thermal resistance increases and flooding occurs
Solution Approach 1:
The patent implements a flow restrictor that creates different liquid depths in different regions of the evaporator. A thin layer of liquid is maintained over the heat transfer region where the evaporator contacts the electronic device, while a deeper pool of liquid is created in a separate region. This local differentiation optimizes heat transfer efficiency while preventing flooding in the critical heat exchange zone.
Solution Approach 2:
The flow restrictor acts as an intermediary component between the liquid reservoir and the heat transfer region. It controls and regulates the liquid flow to maintain the optimal thin film thickness, preventing both excessive liquid accumulation (flooding) and insufficient liquid coverage (reduced heat transfer area).
3Strength
If the condenser has a top header, then structural integrity is improved, but vertical space consumption increases
Solution Approach 1:
The patent divides the condenser into multiple independent vertical chambers that stand without requiring a top header for structural support. Each chamber is self-supporting, and the segmentation allows the system to achieve structural integrity through distributed support rather than relying on a spanning top header, thereby reducing vertical space requirements.
4Temperature
If fans are used for forced convection cooling, then cooling effectiveness is improved, but device complexity and power consumption increase
Solution Approach 1:
The thermosiphon system operates autonomously using natural convection and phase change of the working fluid. The fluid circulates between the evaporator and condenser without requiring mechanical pumps or fans, achieving self-service cooling that reduces device complexity and power consumption while maintaining effective heat removal from electronic devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively reduces thermal resistance, preventing flooding and improving heat transfer efficiency, thereby enhancing the reliability and performance of heat removal from electronic devices.
Implementation Method 1
A liquid form of the fluid is vaporized in an evaporator
Implementation Method 2
Thermosiphons are heat exchangers that operate using a fluid that undergoes a phase change
Implementation Method 3
heat is carried by the vapor form of the fluid from the evaporator to a condenser
Implementation Method 4
In the condenser, the vapor condenses
Implementation Method 5
the liquid form of the fluid is then returned via gravity to the evaporator
Implementation Method 6
a wick located in the housing, and a flow restrictor located in the housing configured to restrict flow of a working fluid from the condensate line onto a portion of the wick
Data Source
AI summary
A thermosiphon system includes a condenser and an evaporator fluidically coupled to the condenser by a condensate line. The evaporator includes a housing having an opening to the condensate line, a wick located in the housing, and a flow restrictor located in the housing configured to restrict flow of a working fluid from the condensate line onto a portion of the wick.