Thermosyphon Power Electronics Cooling With EMI Shielded Housing
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Solution Overview
Problem
Existing cooling systems for power electronics in electric vehicles are inefficient and do not effectively manage electromagnetic interference, leading to reduced performance and range.
Innovation Solution
A thermosyphon-based cooling system with a shield and inclined housing design that utilizes a self-sustaining fluid flow to enhance cooling without pumps, incorporating a hydrophobic coating to manage fluid flow and reduce electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional cooling systems with pumps are used, then cooling capability is provided, but system complexity and weight increase
Solution Approach 1:
The thermosyphon system enables self-service cooling by utilizing natural convection and phase change of the cooling fluid. The inclined housing design allows the cooling fluid to automatically circulate from the electronic components through the heat exchange channels and back, eliminating the need for external pumps or complex control systems while maintaining effective cooling capability
Solution Approach 2:
The patent replaces the mechanical pump-based cooling system with a passive thermosyphon system that uses thermal buoyancy and phase change mechanisms. This substitution eliminates moving mechanical parts while achieving the same cooling function through fluid dynamics and heat transfer principles
2Object-affected harmful factors
If shields are added to block electromagnetic interference, then electromagnetic interference is reduced, but device complexity increases
Solution Approach 1:
The housing structure performs multiple functions simultaneously: it provides mechanical enclosure for the electronic components, contains the cooling fluid and thermosyphon channels, and acts as an electromagnetic shield. This multi-functionality reduces overall device complexity while maintaining EMI protection
Solution Approach 2:
The patent merges the shield function with the housing structure itself. The housing is designed to provide both structural containment and electromagnetic shielding in a single integrated component, eliminating the need for separate shield elements and reducing overall system complexity
3Temperature
If cooling fluid level is reduced to improve heat exchange efficiency, then cooling efficiency increases, but fluid flow stability deteriorates
Solution Approach 1:
The thermosyphon system employs dynamic fluid levels that adjust automatically based on thermal loading conditions. The inclined housing design creates natural convection currents that maintain stable fluid circulation even with reduced fluid volume, allowing the system to adapt to varying cooling demands while preserving flow stability
Solution Approach 2:
The patent changes the fluid level parameter to optimize heat exchange efficiency. By reducing the cooling fluid level while maintaining the inclined housing configuration, the system achieves better thermal contact with electronic components and improved heat exchange efficiency without compromising fluid flow stability through the thermosyphon effect
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances cooling capability, reduces weight, and increases the range of electric vehicles by providing efficient two-phase immersive cooling while minimizing electromagnetic interference.
Implementation Method 1
A thermosyphon-based cooling system with a shield and inclined housing design that utilizes a self-sustaining fluid flow to enhance cooling without pumps
Implementation Method 2
providing efficient two-phase immersive cooling
Implementation Method 3
utilizes a self-sustaining fluid flow to enhance cooling without pumps
Implementation Method 4
incorporating a hydrophobic coating to manage fluid flow
Data Source
AI summary
A cooling system includes a housing including a base portion with sides and a bottom surface that define a cavity and a cover portion to enclose the base portion and including cooling members attached thereto. A shield is arranged in the cavity. A vertical member is arranged below the shield to define a first fluid chamber between one side of the vertical member and one side of the base portion and a second fluid chamber between an opposite side of the vertical member and another side of the base portion. The electronic components are arranged in the second fluid chamber. Cooling fluid is arranged in the cavity and has a fluid level below at least a portion of the shield. The housing is mounted at an inclined angle relative to horizontal or the housing is mounted parallel to horizontal and the shield is mounted at the inclined angle.