Thick Buffer Layer Blocks Impurity Migration in Semiconductor Lasers

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Semiconductor lasers exhibit significant lasing wavelength variability due to impurity and point defect migration from substrates during growth and thermal treatment, leading to low yield and increased costs as wafers from the same boule can have varying wavelengths, causing some to fall outside desired ranges.

Innovation Solution

A thick buffer layer with a thickness greater than 2 micrometers is introduced between the substrate and epitaxial layers to block impurity and defect migration, ensuring a smooth interface for epitaxial growth and reducing unintended quantum well intermixing, thereby controlling lasing wavelength variability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a thin buffer layer is used, then device complexity is reduced, but lasing wavelength variability increases due to impurity and defect migration

Engineering Contradiction:
Improvebuffer layer thicknessVSAvoidlasing wavelength variability
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

A thick buffer layer (greater than 2 micrometers) is introduced as an intermediary between the substrate and epitaxial layers. This buffer layer acts as a barrier that prevents impurity and point defect migration from the substrate to the quantum well layer, thereby controlling lasing wavelength variability without requiring changes to the epitaxial growth process itself.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The thick buffer layer serves as a sacrificial or disposable element that absorbs the harmful effects of substrate impurities and defects. By making the buffer layer thick enough to block migration, the system tolerates variations in substrate quality without affecting the performance of the quantum well layer, effectively using the buffer as a protective barrier that can be optimized independently.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

2Manufacturing precision

If a thick buffer layer is used, then lasing wavelength variability is reduced, but manufacturing cost increases

Engineering Contradiction:
Improvelasing wavelength variabilityVSAvoidmanufacturing cost
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The buffer layer thickness parameter is changed from the conventional thin layer to a thick layer (greater than 2 micrometers). This parameter change fundamentally alters the diffusion dynamics, creating a sufficient barrier against impurity and defect migration. The thick buffer layer enables better wavelength control, which reduces waste and improves yield, ultimately offsetting the increased material cost.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The thick buffer layer converts the potentially harmful effect of substrate impurities and defects into a beneficial outcome. By allowing these impurities to remain confined to the substrate and buffer layer region, the quantum well layer is protected from contamination, ensuring consistent lasing wavelength and high device yield. The buffer layer absorbs the harm of substrate imperfections and transforms it into a reliable production process.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

3Manufacturing precision

If a thick buffer layer is used, then quantum well intermixing is reduced, but production time increases

Engineering Contradiction:
Improvequantum well intermixing controlVSAvoidproduction time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The thick buffer layer is formed in advance during the epitaxial growth process, establishing a protective barrier before the quantum well layer is grown. This preliminary action of creating a thick buffer layer prevents subsequent impurity and defect migration during thermal treatment and device operation, eliminating the need for additional corrective steps or process optimizations later in manufacturing.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The thick buffer layer significantly reduces lasing wavelength variability across different wafers from the same boule, improving production yield and reducing waste by maintaining wavelengths within a narrow range, thus enhancing the efficiency and cost-effectiveness of semiconductor laser production.

Implementation Method 1

A thick buffer layer with a thickness greater than 2 micrometers is introduced between the substrate and epitaxial layers to block impurity and defect migration

Methodology Applied
Scientific EffectDiffusion barrier: Diffusion Barrier

Implementation Method 2

a quantum well intermixing region is formed within the quantum well layer by a material diffused from a region of a surface of a semiconductor layer structure using quantum well intermixing

Methodology Applied
Scientific EffectDiffusion: Diffusion

Data Source

PatentUS11038320B2Semiconductor layer structure with a thick buffer layer
Publication Date: 2021.06.15 WELLS FARGO BANK NA
  • US11038320B2 patent drawing
  • US11038320B2 patent drawing
  • US11038320B2 patent drawing

AI summary

A semiconductor layer structure may include a substrate, a buffer layer formed on the substrate, and a set of epitaxial layers formed on the buffer layer. The buffer layer may have a thickness that is greater than 2 micrometers (μm). The set of epitaxial layers may include a quantum well layer. A quantum well intermixing region may be formed in association with the quantum well layer and a material diffused from a region of a surface of the semiconductor layer structure.