Thick Copper Substrate for High Frequency Semiconductor Heat Dissipation
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Solution Overview
Problem
Current semiconductor devices with high frequency circuits face challenges in heat dissipation due to the low thermal conductivity of traditional printed circuit boards, leading to increased thermal resistance and larger chip sizes, which complicates the integration of complex high frequency circuits without increasing package size or cost.
Innovation Solution
A semiconductor device design featuring a thick copper member with external electrode terminals, a printed circuit board with a multilayer structure and conductive vias, and semiconductor chips mounted on the copper member's surface, allowing for effective heat dissipation through the copper member while maintaining a compact package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a traditional printed circuit board with organic substrate is used, then the device structure is simple and cost is low, but thermal conductivity is poor leading to high thermal resistance and temperature rise
Solution Approach 1:
The patent uses a composite substrate structure combining organic substrate and ceramic substrate. The organic substrate provides ease of manufacture and cost-effectiveness, while the ceramic substrate layer provides high thermal conductivity to reduce thermal resistance. This composite material approach resolves the contradiction between manufacturing simplicity and thermal performance.
2Temperature
If the gate interval in the semiconductor element is increased to reduce thermal resistance, then thermal management improves, but the chip size increases leading to larger package size
Solution Approach 1:
The patent extracts the thermal management function from the semiconductor element design itself and relocates it to the substrate structure. By providing a dedicated high-thermal-conductivity ceramic substrate layer beneath the semiconductor element, the thermal resistance is reduced without requiring changes to the element's gate interval or increasing chip size.
3Temperature
If multiple semiconductor chips are used to reduce thermal resistance, then heat dissipation improves, but the mounting area increases leading to larger package size
Solution Approach 1:
The patent merges multiple functions into a single ceramic substrate layer: it serves as the mounting base for semiconductor elements, provides high thermal conductivity for heat dissipation, and acts as a thermal pathway to conduct heat away from the elements. This consolidation achieves effective heat dissipation without increasing the mounting area or package size.
4Temperature
If the chip size of the semiconductor element is increased, then thermal resistance reduces, but the cost of the chip increases
Solution Approach 1:
The patent introduces a ceramic substrate layer as an intermediary between the semiconductor element and the organic substrate. This intermediary layer provides the thermal management function, allowing the semiconductor element itself to maintain a smaller, more cost-effective size while still achieving low thermal resistance through the ceramic substrate's high thermal conductivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables high heat dissipation characteristics even with complex high frequency circuits, preventing the deterioration of high frequency performance and allowing for miniaturization of semiconductor chips, thus maintaining high-frequency characteristics while reducing costs.
Implementation Method 1
a thick copper member 14 on which a semiconductor chip 1 is mounted
Implementation Method 2
conductive vias 7 connecting the wiring pattern 21 and the thick copper member 14
Data Source
AI summary
A semiconductor device includes: a thick copper member in which a semiconductor chip is mounted; a printed circuit board that is disposed on a front surface of the thick copper member and provided with an opening exposing a part of the front surface of the thick copper member, a wiring pattern, and conductive vias connecting the pattern and the thick copper member; a semiconductor chip mounted on the front surface of the thick copper member exposed through the opening and connected to the pattern by a metal wire; an electronic component mounted on a front surface of the printed circuit board opposite to a side facing the thick copper member and connected to the pattern; and a cap or an epoxy resin sealing the front surface of the printed circuit board opposite to a side facing the thick copper member, the chip, the component, and the metal wire.