Thick Film Element High Heat Conductivity Covering Layer
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Solution Overview
Problem
Conventional thick film heating elements suffer from low thermal efficiency, bulkiness, ease of staining, and hazardous materials, with limited capability for direct unilateral heating, leading to high heat loss and short service life.
Innovation Solution
A thick film element with a high heat conductivity covering layer, comprising a carrier, thick film coating, and a dielectric covering layer, where the heat transfer rates and conductivity coefficients of each layer are optimized to ensure efficient heat transfer and prevent overheating, allowing for direct heating and reduced heat loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional indirect heating methods (electrical heated tube or PTC heating) are used, then heating function is achieved, but thermal efficiency is low and device volume is large
Solution Approach 1:
The patent extracts the heating function from separate heating components (heated tubes or PTC elements) and integrates it directly into the thick film circuit pattern on the substrate. The thick film heating element itself becomes the heat source, eliminating the need for separate indirect heating devices and improving thermal efficiency while reducing overall device volume.
Solution Approach 2:
The patent merges the circuit function and heating function into a single integrated structure. The thick film pattern serves both as the electrical circuit and as the heating element, combining multiple functions into one component to achieve direct heating with high thermal efficiency and compact size.
2Loss of energy
If thick film conductor is combined with substrate through insulating layer, then electrical insulation is achieved, but direct heat transfer from thick film to substrate is prevented
Solution Approach 1:
The patent applies different structural configurations to different regions of the thick film element. In areas where direct heat transfer is needed, the thick film conductor contacts the substrate directly without an insulating layer. In areas where electrical insulation is required, the insulating layer is present. This localized differentiation allows simultaneous achievement of direct heating and electrical insulation where needed.
3Object-affected harmful factors
If conventional heating elements are used, then heating is achieved, but environmental pollution and safety issues arise from lead and hazardous substances
Solution Approach 1:
The patent changes the material composition parameters of the thick film heating element, using lead-free and hazard-free materials instead of conventional materials containing lead and other toxic substances. This material substitution maintains the heating functionality while eliminating environmental pollution and safety issues, and also improves oxidation resistance and service life.
4Loss of energy
If thick film heating element transfers heat to both sides of substrate, then heat dissipation is improved, but heat loss increases when only single-side heating is required
Solution Approach 1:
The patent segments the heating function to operate unilaterally rather than bilaterally. By configuring the thick film heating element to transfer heat primarily to one side of the substrate, the design divides the heat transfer function into directed unilateral transmission rather than distributed bilateral transmission, reducing heat loss when single-side heating suffices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a compact, efficient, and environmentally friendly thick film heating element with high power density, fast heating, and long service life, capable of single-sided heat transfer with improved thermal conduction and safety.
Implementation Method 1
the thick film coating is a heating material, and the mode of heating is electrical heating
Implementation Method 2
a covering layer overlaid on the coating... λ1 represents the heat conductivity coefficient of the covering layer
Data Source
AI summary
The present invention provides a thick film element having a covering layer with high heat conductivity, which comprises a carrier, a thick film coating deposited on the carrier and a covering layer overlaid on the coating. The thick film coating is a heating materials, and the mode of heating is electrical heating. The covering layer, the thick film coating and the carrier are selected from a material that fulfills every of the following equations:λ1AT1-T0d1=a×λ3AT3-T0d3,λ2AT2-T0d2=b×λ1AT1-T0d1,λ2AT2-T0d2=c×λ3AT3-T0d3;wherein 200≤a≤104, 0<b≤1000, 0<c≤5×105. The covering layer of the thick film element of the present invention has high heat conductivity, and is suitable for coating products with a single-sided heating covering layer. The present invention improves heat transfer efficiency and reduces heat loss when double-sided heating is not required.