Thick Metal Adapter for Laser Diode Thermal Stress

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Solution Overview

Problem

Existing adapter elements for connecting laser diodes to heat sinks fail to withstand high temperature loads and effectively manage thermomechanical stresses caused by differing expansion coefficients, leading to potential deformation or cracking of the laser diode.

Innovation Solution

The use of an adapter element with a thick metal layer (>40 μm) and a ceramic intermediate layer, optimized through a DCB or active soldering process, to ensure homogeneous heat distribution and adjust thermal expansion coefficients, thereby reducing thermomechanical stresses and preventing deformation or cracking.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If thin metal layers are used in the adapter element, then the manufacturing process is simpler and faster, but the adapter element cannot withstand high temperature loads and thermomechanical stresses

Engineering Contradiction:

Improvemanufacturing simplicity and speedVSAvoidwithstand high temperature loads

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent changes the thickness parameter of the metal layers from thin to thick (>40 μm, preferably >70 μm, particularly preferably >100 μm). This parameter change enables the adapter element to withstand high temperature loads and thermomechanical stresses during operation while maintaining manufacturing feasibility through DCB or active soldering processes

Inventive Principle:

Principle #35Parameter changes

2Ease of manufacture

If thin metal layers are used in the adapter element, then the manufacturing process is simpler and faster, but the adapter element cannot effectively adapt expansion coefficients

Engineering Contradiction:

Improvemanufacturing simplicity and speedVSAvoidadaptation of expansion coefficients

Core Design Contradiction:

Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The patent changes the thickness parameter of the metal layers to greater than 40 μm (preferably greater than 70 μm, particularly preferably greater than 100 μm). This parameter change enables effective adaptation of expansion coefficients between the laser diode and heat sink, preventing thermomechanical stresses while remaining manufacturable through DCB or active soldering processes

Inventive Principle:

Principle #35Parameter changes

3Reliability

If thick metal layers are used in the adapter element, then thermal expansion is supported and heat distribution is homogeneous, but the manufacturing process becomes more complex and time-consuming

Engineering Contradiction:

Improvethermal expansion support and heat distributionVSAvoidmanufacturing complexity and time

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent specifies a particular thickness range for the metal layers (>40 μm, preferably >70 μm, particularly preferably >100 μm) that optimizes the balance between thermal performance and manufacturability. This parameter change supports thermal expansion and ensures homogeneous heat distribution while being compatible with DCB or active soldering manufacturing processes

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent replaces traditional thin-layer metal bonding methods with DCB (Direct Copper Bonding) or active soldering processes. This substitution enables the reliable manufacturing of thick metal layers (>100 μm) that provide superior thermal and mechanical performance without excessive manufacturing complexity

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution provides a stress-free interface between the heat sink and laser diode, preventing deformation and cracking, while allowing for easy and quick manufacturing and efficient heat transport, thus enhancing the reliability of the cooling system.

Implementation Method 1

the thickness of which has the advantage of supporting thermal expansion during heat transport through the adapter element. This heat spread, in turn, leads to the most homogeneous heat distribution in an interface area between the heat sink and the adapter element

Methodology Applied

Scientific EffectHeat transport: Conduction (thermal)

Implementation Method 2

the intermediate layer comprising ceramic arranged between the first metal layer and the second metal layer wherein the first metal layer and/or the second metal layer is thicker than 40 μm... supporting thermal expansion during heat transport

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS11476640B2Adapter element for connecting a component, such as a laser diode, to a heat sink, a system comprising a laser diode, a heat sink and an adapter element and method for producing an adapter element

Publication Date: 2022.10.18 ROGERS GERMANY

AI summary

An adapter element (10) for connecting a component (4), such as a laser diode, to a heat sink (7), comprising: a first metal layer (11), which in a mounted state faces the component (4), and a second metal layer (12), which in the mounted state faces the heat sink (7), and an intermediate layer (13) comprising ceramic arranged between the first metal layer (11) and the second metal layer (12), wherein the first metal layer (11) and/or the second metal layer (12) is thicker than 40 μm, preferably thicker than 70 μm and more preferably thicker than 100 μm.