Thick Metal Layer PCB Heat Dissipation Design
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Solution Overview
Problem
Existing printed circuit boards face inefficiencies in heat dissipation, leading to insufficient thermal management and potential upsizing issues when attempting to enhance heat release from electronic devices.
Innovation Solution
A printed circuit board design featuring multiple metal layers with thick intermediate metal layers connected to ground and power supply terminals, combined with a heat dissipation member and metallic coating layers, allows for effective heat transfer and release without increasing board size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heatsink is provided on the mounting surface of the heat generating element to improve heat dissipation, then heat dissipation effect is improved, but board size increases
Solution Approach 1:
The patent transitions from two-dimensional heat dissipation on the board surface to three-dimensional heat dissipation by utilizing the vertical space within the board structure. Multiple metal layers are stacked in the thickness direction, creating internal heat dissipation pathways that do not increase the board's planar area.
Solution Approach 2:
The patent embeds multiple metal heat dissipation layers within the board structure, nesting them between insulating layers. The metal layers are positioned at different heights (first, second, and third metal layers), creating a nested configuration that maximizes heat dissipation surface area within the board's thickness without increasing board footprint.
2Area of stationary object
If conventional heat dissipation structures are used with thin metal layers, then board size is maintained, but heat dissipation efficiency is insufficient
Solution Approach 1:
The patent applies different metal layer thicknesses at different locations and positions within the board structure. The first metal layer has a first thickness, the second metal layer has a second thickness greater than the first, and the third metal layer has a third thickness greater than the second. This localized variation in thickness optimizes heat dissipation efficiency in regions with higher heat generation while maintaining overall board size constraints.
Solution Approach 2:
The patent changes the thickness parameter of metal layers at different positions to optimize heat dissipation. By increasing the thickness of the second and third metal layers compared to the first metal layer, the patent enhances thermal mass and heat conduction capacity in critical areas without proportionally increasing overall board size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation efficiency, stabilizes signal transmission, and maintains board size, while ensuring reliable thermal management and signal quality.
Implementation Method 1
the heat generated in the electronic device is transferred to the thick metal layer connected to one of the ground terminal and the power supply terminal from the electronic device
Data Source
AI summary
A printed circuit board includes a plurality of metal layers, a plurality of insulating layers provided between the respective metal layers of the plurality of metal layers, and an electronic device provided on one metal layer of the plurality of metal layers. The plurality of metal layers include a first outer metal layer and a second outer metal layer located on the outermost side of the plurality of metal layers and a plurality of intermediate metal layers located between the first outer metal layer and the second outer metal layer. At least one of the plurality of intermediate metal layers is a thick metal layer thicker than the first outer metal layer and the second outer metal layer. The thick metal layer is connected to one of a ground terminal of the electronic device and a power supply terminal of the electronic device.