Thick Superconductor Films via Fluoride Solution Deposition
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Solution Overview
Problem
Current methods for producing thick superconducting films with high critical current density are costly and inefficient, particularly due to high capital costs and limited deposition rates in physical vapor deposition methods, and the need for chemically compatible biaxially textured buffer layers.
Innovation Solution
A composition and process for depositing a precursor solution onto a substrate to form a thick superconducting film using a non-vacuum solution deposition method, where the precursor solution includes fluoride-containing salts, allowing for a high deposition rate and conversion to a superconducting phase through thermal processing, with a transition metal to alkaline earth metal ratio greater than 1.5, and the inclusion of additives for flux pinning sites.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If physical vapor deposition methods are used to deposit superconducting films, then film quality and critical current density are improved, but capital costs increase and deposition rates are limited
Solution Approach 1:
The patent changes the deposition method from physical vapor deposition to solution-based deposition, altering the physical and chemical parameters of the process. This enables thick film deposition (>0.8 μm) with high deposition rates while maintaining film quality through controlled solution chemistry and thermal processing parameters
Solution Approach 2:
The patent replaces the mechanical/physical vapor deposition system with a chemical solution deposition system. This substitution eliminates vacuum system requirements and enables rapid deposition of thick precursor layers that can be subsequently converted to superconducting phase through thermal processing
2Manufacturing precision
If physical vapor deposition methods are used to deposit superconducting films, then film quality is improved, but capital costs increase
Solution Approach 1:
The patent employs inexpensive solution-based deposition methods that eliminate the need for expensive vacuum deposition equipment. The precursor solutions can be deposited using simple coating techniques, and the process does not require costly vacuum systems, thereby reducing capital costs while maintaining film quality through controlled solution chemistry
Solution Approach 2:
The patent replaces the expensive physical vapor deposition mechanical system with a chemical solution deposition system. This substitution eliminates vacuum equipment requirements and associated high capital costs, while film quality is maintained through controlled solution parameters and thermal processing
3Manufacturing precision
If thick layers of superconductor precursor composition are deposited, then critical current density is improved, but deposition time increases in conventional methods
Solution Approach 1:
The patent changes the deposition parameters by using solution-based methods that enable rapid deposition of thick precursor layers (>0.8 μm). The solution chemistry allows for high concentration precursor deposition, and subsequent fast thermal processing converts the precursor to superconducting phase, achieving high critical current density in reduced time
Solution Approach 2:
The patent performs preliminary deposition of thick precursor layers using rapid solution-based methods before thermal conversion. This preliminary action deposits the necessary material thickness quickly, and the subsequent thermal processing step converts the precursor to the functional superconducting phase, achieving both thickness and performance requirements efficiently
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of thick, high-critical current density superconducting films with improved texture and current carrying ability, reducing costs and increasing efficiency in fabricating materials for applications such as cables and magnet systems.
Implementation Method 1
depositing a first precursor solution onto a substrate to form a precursor film
Implementation Method 2
treating the precursor film to form a rare earth-alkaline earth metal-transition metal oxide superconductor
Data Source
AI summary
A method for producing a thick film includes disposing a precursor solution onto a substrate to form a precursor film. The precursor solution contains precursor components to a rare-earth/alkaline-earth-metal/transition-metal oxide including a salt of a rare earth element, a salt of an alkaline earth metal, and a salt of a transition metal in one or more solvents, wherein at least one of the salts is a fluoride-containing salt, and wherein the ratio of the transition metal to the alkaline earth metal is greater than 1.5. The precursor solution is treated to form a rare earth-alkaline earth-metal transition metal oxide superconductor film having a thickness greater than 0.8 μm. precursor solution.