Thickened Alcoholic Composition for Bubble-Free Vertical Bonding
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Solution Overview
Problem
Existing adhesive systems, particularly double-sided adhesive tapes, face challenges in vertical bonding due to air bubbles trapped between substrates, which are both optically and technically disadvantageous and cannot be removed by post-treatments like autoclaving.
Innovation Solution
A thickened alcoholic composition with specific viscosities (1000 to 4000 Pa*s at 0.001/s and 0.1 to 0.3 Pa*s at 1000/s) is applied over the entire surface of the pressure-sensitive adhesive of the adhesive tape to prevent air pockets during vertical joining of substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If double-sided adhesive tapes are used for vertical bonding, then handling and processability are simplified, but air bubbles are trapped between substrates reducing optical quality
Solution Approach 1:
The invention changes the physical parameters of the adhesive by introducing a composition with specific viscosity characteristics (1000-4000 Pa*s at 0.001/s and 0.1-0.3 Pa*s at 1000/s) that allows the adhesive to remain in place during vertical bonding without running off, while still enabling bubble-free bonding
2Strength
If liquid adhesives are used to join substrates, then bonding strength is achieved, but optical quality deteriorates due to blistering or shrinkage
Solution Approach 1:
The invention uses a composition with carefully controlled viscosity parameters that prevent the adhesive from running off during vertical bonding, thereby avoiding blistering and shrinkage while maintaining bonding strength. The specific viscosity range ensures the adhesive stays in position without excessive flow
3Strength
If liquid adhesives are applied to substrates, then bonding is achieved, but the hardening process complicates and lengthens the bonding process
Solution Approach 1:
The invention extracts the hardening step from the bonding process by using a composition that bonds immediately upon application without requiring subsequent hardening or curing steps, thereby simplifying the process and reducing time loss
4Manufacturing precision
If alcohol is applied to pressure-sensitive adhesive to prevent running off, then positioning is improved, but air bubbles are trapped during vertical joining
Solution Approach 1:
The invention changes the parameter of viscosity by using a composition with specific viscosity characteristics (1000-4000 Pa*s at 0.001/s and 0.1-0.3 Pa*s at 1000/s) that allows the adhesive to remain in place during vertical bonding without running off, while still enabling bubble-free bonding
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition prevents air bubbles from forming, enabling bubble-free vertical joining of substrates by maintaining precise positioning and preventing the adhesive from running off, thus ensuring a strong and optically clear bond.
Implementation Method 1
a viscosity of 1000 to 4000 Pa*s at a shear rate of 0.001/s and 25°C and a viscosity of 0.1 to 0.3 Pa*s at a shear rate of 1000 /s and 25 °C
Implementation Method 2
The composition used according to the invention is applied to the pressure-sensitive adhesive of a double-sided adhesive tape over the entire surface before the second part to be joined is vertically joined
Data Source
Figure 1
AI summary
The present invention relates to the use of a thickened alcoholic composition with a viscosity of 1000 to 4000 Pa*s at a shear rate of 0.001/s and 25 °C, and with a viscosity of 0.1 to 0.3 Pa*s at a shear rate of 1000/s and 25 °C, for reducing air inclusions during the vertical bonding of two components. The present invention further relates to a method for the vertical bonding of two components, wherein the composition used according to the invention is applied over the entire surface of the adhesive of a double-sided adhesive tape before the vertical bonding of the second component. Finally, the present invention relates to a kit-of-parts comprising a component, a bonding agent, and the aforementioned composition, with which bubble-free vertical bonding of two substrates is possible.