Thickness-Shear Acoustic Wave Structure for High-Frequency Linearity
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Solution Overview
Problem
Conventional surface acoustic wave devices face challenges in increasing frequency and maintaining linearity due to harmonic distortion and intermodulation distortion, particularly with materials like LiTaO3 and silicon oxide.
Innovation Solution
The acoustic wave device employs a bulk wave of thickness-shear primary mode using a silicon substrate with a lithium niobate or lithium tantalate piezoelectric layer, featuring a trap region and electrode configuration where the distance between electrode center lines is less than half the thickness of the piezoelectric layer, enhancing frequency handling and linearity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional surface acoustic wave device structure is used, then device operation is achieved, but frequency increase is limited and linearity degrades due to harmonic distortion and intermodulation distortion
Solution Approach 1:
The patent changes the fundamental operating mode from surface acoustic wave to bulk acoustic wave (thickness-shear mode), and modifies the electrode configuration parameter by setting the distance between electrode center lines to less than half the piezoelectric layer thickness. These parameter changes eliminate the harmful distortion mechanisms while maintaining device functionality.
Solution Approach 2:
Instead of using the conventional surface acoustic wave propagation mode, the patent inverts the approach by utilizing bulk acoustic wave propagation in the thickness-shear mode. This fundamental inversion of the wave mode eliminates the distortion issues inherent in surface wave devices.
2Speed
If frequency is increased in conventional devices, then higher frequency operation is attempted, but linearity degrades due to distortion
Solution Approach 1:
The patent achieves higher frequency operation by transitioning to bulk wave thickness-shear mode and adjusting the electrode spacing parameter (distance between center lines less than half the piezoelectric layer thickness). These parameter changes enable frequency increases while preserving linearity, unlike conventional surface wave devices where frequency increases cause distortion.
3Volume of moving object
If electrode pairs are reduced to miniaturize the device, then device size decreases, but Q value becomes insufficient
Solution Approach 1:
The patent changes the wave propagation mode from surface acoustic wave to bulk acoustic wave in thickness-shear mode. This parameter change fundamentally alters the Q value characteristics, allowing the device to maintain sufficient Q value even with reduced electrode pairs, thereby enabling miniaturization without sacrificing performance.
4Ease of manufacture
If conventional materials (silicon oxide, LiTaO3) are used, then device manufacturing is straightforward, but frequency increase is limited and linearity degrades
Solution Approach 1:
The patent changes the operational parameters by using bulk acoustic wave thickness-shear mode instead of surface acoustic wave mode, and by configuring the electrode distance to be less than half the piezoelectric layer thickness. These parameter changes enable the conventional materials to achieve higher frequencies and better linearity, resolving the contradiction between ease of manufacture and performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for higher frequency operation while improving linearity and maintaining a sufficient Q value, even with reduced electrode pairs, and reduces charge movement, thereby enhancing the device's performance.
Implementation Method 1
A material of the piezoelectric layer is lithium niobate or lithium tantalate. The acoustic wave device uses a bulk wave of a thickness-shear primary mode
Implementation Method 2
The acoustic wave device further includes a trap region in the silicon substrate
Data Source
AI summary
An acoustic wave device includes a piezoelectric layer and first and second electrodes. The first and second electrodes face each other in a direction intersecting with a thickness direction of the piezoelectric layer. The acoustic wave device uses a bulk wave of a thickness-shear primary mode. A material of the piezoelectric layer is lithium niobate or lithium tantalate. The piezoelectric layer is on a first main surface of the silicon substrate. The acoustic wave device further includes a trap region on a side of a second main surface of the piezoelectric layer.


