Thin Adhesive Connecting Structure for Fine-Pitch Electrode Bonding
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Solution Overview
Problem
Existing bonding technologies face challenges in achieving a small size and low height while maintaining electrode reliability, particularly when narrow pitches lead to short-circuiting and reduced reliability due to adjacent electrode connections.
Innovation Solution
A connecting structure with a thin adhesive layer (≤15 μm) and spaced electrode arrangement, using an anisotropic electrically conductive adhesive film with controlled solder particle size (≤3 μm) to ensure reliable electrical connection between electrodes without short-circuiting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the adhesive layer thickness is reduced to achieve low height, then the mounting thickness is reduced, but the electrodes may short-circuit when forcibly pressed during mounting
Solution Approach 1:
The patent changes the physical and chemical parameters of the adhesive material by using an anisotropic electrically conductive adhesive film containing solder particles and a thermosetting resin. This allows the adhesive layer to maintain electrical conductivity in the thickness direction while providing mechanical strength to prevent short-circuiting during pressing, resolving the contradiction between thin thickness and reliable connection.
2Area of stationary object
If the electrode pitch is narrowed to achieve small size, then the mounting area is reduced, but adjacent electrodes may short-circuit when the thick film is forcibly pressed
Solution Approach 1:
The patent uses a composite adhesive film containing both solder particles (for electrical conductivity) and a thermosetting resin (for mechanical strength and insulation). This composite structure allows narrow electrode pitch while preventing short-circuits between adjacent electrodes during pressing, as the resin provides structural support and electrical isolation in the plane direction.
3Length of stationary object
If the adhesive layer is made thin to achieve low height, then the overall height is reduced, but the electrical connection between facing electrodes may be insufficient
Solution Approach 1:
The patent creates local electrical conductivity within the adhesive layer by dispersing solder particles throughout the thermosetting resin matrix. This allows different regions of the adhesive to have different functions: the solder particles provide localized conductive pathways between facing electrodes, while the resin provides overall structural support, enabling thin thickness with reliable electrical connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a low-height connection with improved reliability by ensuring that the distance between adjacent electrodes in the plane direction is longer than the distance between facing electrodes, preventing short-circuits and enhancing overall connectivity.
Implementation Method 1
the electrically conductive film is heated. Thus, the solder particles included in the electrically conductive film are melted, thereby forming a solder portion electrically connecting the first electrode to the second electrode
Implementation Method 2
an adhesive layer interposed between the first substrate and the second substrate, electrically connecting the first electrode and the second electrode facing each other in the thickness direction, and adhering the first substrate to the second substrate
Data Source
AI summary
A connecting structure includes a first substrate having a plurality of first electrodes arranged in a plane direction; a second substrate having a plurality of second electrodes arranged in the plane direction and disposed at a spaced interval with respect to the first substrate in a thickness direction perpendicular to the plane direction so that the first electrode faces the second electrode; and an adhesive layer interposed between the first substrate and the second substrate, electrically connecting the first electrode and the second electrode facing each other in the thickness direction, and adhering the first substrate to the second substrate. A thickness of the adhesive layer is below 15 μm. A distance A between the first electrodes adjacent to each other In the plane direction is longer than a distance B between the first electrode and the second electrode facing each other in the thickness direction.