Thin Adhesive Layer for Heat Exchanger Element Bonding
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Solution Overview
Problem
Current methods for producing heat exchanger elements are time-consuming and expensive due to the need for soldering or high-layer adhesive application, which restricts material compatibility and increases costs, while also reducing service life with thermal changes.
Innovation Solution
A method involving the application of a thin adhesive layer (10 µm to 500 µm thick) between heat exchanger elements, which are then joined at a temperature of 100°C to 200°C, ensuring a secure and stable bond with reduced material usage and faster curing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If soldering is used to connect heat exchanger elements, then the connection is strong and sealed, but the process is time-consuming and expensive, requiring temperatures close to the melting point of the base material and multiple steps
Solution Approach 1:
The patent changes the temperature parameter from soldering temperatures (close to base material melting point, around 650°C) to adhesive curing temperatures (100°C to 200°C). This parameter change enables a completely different joining method that is faster and less energy-intensive while achieving comparable connection strength through chemical bonding rather than metallurgical bonding.
Solution Approach 2:
The patent replaces the mechanical/thermal soldering process with a chemical adhesive bonding process. Instead of melting and flowing solder material to create joints, the invention uses adhesive layers that cure through chemical reactions, eliminating the need for high-temperature furnaces and complex soldering procedures.
2Reliability
If soldering is used to connect heat exchanger elements, then the connection is sealed, but the process is expensive and complex, requiring fluxes, degreasing, and multiple quality checks
Solution Approach 1:
The patent extracts and eliminates the complex intermediate steps of the soldering process (degreasing, flux application, high-temperature heating, quality checks) by replacing them with a single adhesive application and curing step. The adhesive itself provides both sealing and bonding functions, removing the need for separate flux and sealing materials.
Solution Approach 2:
The adhesive layer performs multiple functions simultaneously: it bonds the heat exchanger elements together, seals the joints to prevent leakage, and compensates for thermal expansion differences. This multi-functionality replaces the separate roles previously filled by solder, flux, and thermal expansion compensation mechanisms.
3Adaptability or versatility
If different materials are connected through soldering, then the connection can be made, but the thermal expansion differences reduce service life with frequent thermal changes
Solution Approach 1:
The patent changes the bonding mechanism from rigid metallurgical bonding to flexible chemical bonding. The adhesive layer can accommodate thermal expansion and contraction of different materials without creating stress concentrations that would lead to failure, thereby extending service life while maintaining material compatibility.
Solution Approach 2:
The patent uses composite material structures where heat exchanger elements made of different materials (e.g., aluminum and copper) are joined by an adhesive layer. This creates a composite joint that leverages the advantages of each material while the adhesive compensates for their incompatibilities, particularly thermal expansion differences.
4Adaptability or versatility
If adhesive bonding is used with layer thicknesses greater than 1mm, then the flexibility for thermal expansion compensation is improved, but the curing time increases and costs increase due to large amounts of adhesive
Solution Approach 1:
The patent optimizes the adhesive layer thickness parameter to the range of 10 µm to 500 µm. This parameter optimization achieves the right balance: the layer is thin enough to cure quickly and use minimal adhesive, yet thick enough to provide sufficient flexibility for thermal expansion compensation and adequate bonding strength.
Solution Approach 2:
The patent applies adhesive in a controlled, moderate amount (10-500 µm thickness) rather than using excessive thickness (>1mm). This partial action approach provides just enough adhesive to achieve the required bonding and thermal compensation without the diminishing returns of excessive adhesive that would increase curing time and cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in cost-effective, high-quality heat exchanger production with improved durability and media resistance, while accommodating different thermal expansions without the limitations of traditional soldering or high-adhesive methods.
Implementation Method 1
a first heat exchanger element and with a second heat exchanger element, the two heat exchanger elements being connectable to one another at respective contact surfaces
Implementation Method 2
the heat exchanger elements are joined at a temperature of approx. 100° C. to 200° C. or the heat exchanger elements to be connected are heated to a temperature of 100° C. to 200° C. for a predeterminable period of time after joining
Data Source
Figure 1~2
Figure 3
AI summary
The invention relates to a method for producing connected heat exchanger elements (1, 2, 4, 5) having a first heat exchanger element (1, 4) and a second heat exchanger element (2, 5), wherein the two heat exchanger elements can be connected to one another at respective contact surfaces, and an areal adhesive layer (3, 6) approximately 10 µm to 500 µm thick is applied to at least one of the heat exchanger elements (1, 2, 4, 5) and the two heat exchanger elements (1, 2, 4, 5) to be connected are joined to one another at the contact surfaces with interposition of the adhesive layer (3). The invention also relates to a connected heat exchange element and a heat exchanger related thereto.