Thin Chip Pickup via Partial Peeling on Adhesive Tape
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for picking up thin chips from a tape often result in damage due to localized force application and require frequent replacement of thrust-up members, which is cumbersome and time-consuming.
Innovation Solution
A method and apparatus that involves partial peeling of the chip from the tape while sucking and holding the tape, forming a peeled region and an affixed region, allowing the chip to be picked up without damage and without replacing the thrust-up member, by aligning the boundary line between these regions with saw marks on the chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thrust-up member of size corresponding to the chip is used to pick up thin chips, then chip damage is reduced, but frequent replacement of thrust-up members is required which increases operational complexity and time
Solution Approach 1:
The suction unit is designed to perform multiple functions: it holds both the tape during the partial peeling process and the chip during the pickup process. This eliminates the need for separate thrust-up members for different chip sizes, as the suction unit can adapt to various chip dimensions while maintaining reliable pickup without damage.
Solution Approach 2:
The invention uses suction (pneumatic principle) to hold the tape and chip, replacing the mechanical thrust-up member approach. The suction unit creates a vacuum field that can securely hold different sized chips without physical contact, thereby preventing damage and eliminating the need for replacing mechanical thrust-up members.
2Productivity
If a single thrust-up member is used for all chip sizes, then replacement is eliminated, but chip damage occurs due to localized force application
Solution Approach 1:
The suction unit distributes the holding force across the entire surface of the chip through vacuum pressure, rather than applying localized mechanical force at a single point. This pneumatic approach prevents chip damage while maintaining operational efficiency, as the suction force is evenly distributed and can be adjusted for different chip sizes.
Solution Approach 2:
The suction unit can adjust its suction parameters (vacuum level, contact area) to match different chip sizes and thicknesses. By changing the suction parameters rather than physically replacing the pickup mechanism, the system maintains both high productivity and chip integrity across various chip specifications.
3Ease of operation
If the entire chip is peeled from the tape in one step, then pickup is simplified, but thin chips are damaged due to excessive force
Solution Approach 1:
The pickup process is segmented into two distinct phases: partial peeling and complete pickup. During partial peeling, only a portion of the chip is separated from the tape while the suction unit holds the chip. This segmentation allows the process to proceed gently, preventing damage to thin chips, while still achieving the ultimate goal of complete pickup.
Solution Approach 2:
Instead of applying full peeling force immediately to the entire chip, the invention uses partial action by first peeling only a portion of the chip from the tape. This partial peeling approach reduces the force applied at any one time, protecting thin chips from damage while progressing toward complete pickup.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the safe and efficient pickup of thin chips without damage and eliminates the need for frequent replacement of thrust-up members, reducing operational time and complexity.
Implementation Method 1
by thrusting up the chip by a thrust-up member via the tape while sucking and holding the tape on an outside of the chip to be picked up
Implementation Method 2
forming a peeled region in which a part of the chip is peeled from the tape and an affixed region in which a part including a peripheral edge of the chip is affixed to the tape, by thrusting up the chip by a thrust-up member via the tape
Data Source
AI summary
A pickup method for picking up a chip affixed to a tape from the tape, the pickup method including a partial peeling step of forming a peeled region in which a part of the chip is peeled from the tape and an affixed region in which a part including a peripheral edge of the chip is affixed to the tape, by thrusting up the chip by a thrust-up member via the tape while sucking and holding the tape on an outside of the chip to be picked up, and a pickup step of next peeling a whole area of the chip from the tape and picking up the chip by holding the peeled region of the chip by a chip holder and lifting the chip in a direction in which the chip is separated from the tape.