Thin Coil Component Electrode Layout for Breakdown Voltage
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
There is a need for coil electronic components with improved breakdown voltage (BDV), electrode flatness, and a sufficient molded underfill (MUF) gap to address issues of increased current leakage and decreased BDV in thin inductors.
Innovation Solution
The coil electronic component includes a main body with a magnetic material and a coil embedded within, featuring an insulating layer on one surface, conductive layers covering portions of the insulating layer, and external electrodes connecting to the coil. The specific configuration includes a ratio of overlap region length to component length within a range of 0.3 to 0.7, ensuring adequate electrode flatness and MUF gap.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the inductor is made thin to slim down products, then the degree of freedom in component placement is increased, but current leakage increases and breakdown voltage decreases
Solution Approach 1:
An insulating layer is introduced as an intermediary between the coil and the external electrode. This insulating layer prevents direct contact and potential leakage paths while maintaining the thin profile of the inductor, thereby improving breakdown voltage without increasing thickness
2Volume of moving object
If the inductor is made thin to slim down products, then the degree of freedom in component placement is increased, but current leakage increases
Solution Approach 1:
The insulating layer acts as a mediator that blocks current leakage paths between the coil and external electrode, preventing harmful leakage currents while preserving the thin inductor design
3Volume of moving object
If the external electrode configuration is optimized for compactness, then the inductor thickness is reduced, but electrode flatness deteriorates and MUF gap becomes insufficient
Solution Approach 1:
The external electrode is designed to extend in the length direction beyond the coil's length, creating an overlapping region. This dimensional extension provides a larger flat surface area for mounting while maintaining thin profile, improving both electrode flatness and MUF gap
Data Source
AI summary
A coil electronic component includes a main body; a coil embedded in the main body, an insulating layer disposed on one surface of the main body, a first conductive layer covering a portion of the one surface, a second conductive layer covering another portion of the one surface, and first and external electrodes respectively covering the first conductive layer. The coil electronic component has a first length L1 in a first direction, and a second length L2 is a sum of a third length L3 in the first direction of a region where the insulating layer, the first conductive layer, and the first external electrode overlap and a fourth length L4 in the first direction of a region where the insulating layer, the second conductive layer, and the second external electrode overlap. A ratio L2/L1 is 0.3 or more and 0.7 or less.