Thin Coil Component Structure for Inductance and Stiffness

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Solution Overview

Problem

The challenge in miniaturizing and thinning coil electronic components is maintaining their inductance characteristics and stiffness while reducing their thickness, as increasing the magnetic material ratio is limited by the strength of the inductor body and changes in frequency characteristics.

Innovation Solution

A coil electronic component design featuring a support substrate, a coil portion embedded in a body with a cover portion, and external electrodes, where the thickness ratio of the coil portion to the cover portion is maintained between 5:5 to 8:2, ensuring stable strength and characteristics even at a body thickness of 0.55 mm or less.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of moving object

If the thickness of the coil electronic component is reduced to meet miniaturization and thinning demands, then the component size is reduced, but the inductance characteristics and stiffness deteriorate

Engineering Contradiction:
Improvethickness of coil electronic componentVSAvoidinductor stiffness
Core Design Contradiction:
Length of moving objectVSStrength

Solution Approach 1:

The patent applies parameter changes by optimizing the thickness ratio between the coil portion and cover portion to a specific range (5:5 to 8:2), and controlling the body thickness to be 0.55mm or less. This quantitative parameter optimization allows the component to achieve both thinness and maintained stiffness, resolving the contradiction between size reduction and strength preservation.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If the ratio of magnetic material in the core is increased to maintain inductance characteristics, then the inductance performance is improved, but the strength of the inductor body deteriorates due to insulation limitations

Engineering Contradiction:
Improveinductance characteristicsVSAvoidinductor body strength
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent employs composite materials by combining magnetic metal powder with insulating resin in the body structure. This composite approach allows the magnetic material ratio to be increased for better inductance characteristics while the insulating resin component maintains the structural strength and prevents insulation failures, thus resolving the contradiction between inductance performance and body strength.

Inventive Principle:
Principle #40Composite materials

Data Source

PatentUS12288640B2Coil electronic component
Publication Date: 2025.04.29 SAMSUNG ELECTRO MECHANICS CO LTD
  • US12288640B2 patent drawing
  • US12288640B2 patent drawing
  • US12288640B2 patent drawing

AI summary

A coil electronic component includes a support substrate, a coil portion disposed on at least one surface of the support substrate, a body in which the support substrate and the coil portion are embedded, and first and second external electrodes disposed on a surface of the body and connected to both ends of the coil portion, respectively. A thickness of the body is 0.55 mm or less. The body includes a cover portion disposed on the coil portion. A ratio of a thickness of the coil portion to a thickness of the cover portion is 5:5 to 8:2.