Thin Connector With Stacked Spring Contacts

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Solution Overview

Problem

Conventional connectors impair operability when trying to increase the number of contacts without expanding the width dimension orthogonal to the fitting direction, requiring multiple plate-like cables connected to a multi-layer board.

Innovation Solution

A thin connector design featuring a first flat plate connector with superimposed conductive layers and an intermediate insulating layer, and a second flat plate connector with projection arrays, allowing spring contacts to shift and connect with projections, enabling increased contact points without widening the connector's width dimension.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If multiple plate-like cables are connected to a multi-layer board to increase the number of contacts, then the number of contacts increases, but the operability of the connector is impaired

Engineering Contradiction:
Improvenumber of contactsVSAvoidoperability of the connector
Core Design Contradiction:
Quantity of substanceVSEase of operation

Solution Approach 1:

Multiple conductive layers (first conductive layer and second conductive layer) are merged into a single connector structure, allowing multiple contacts to be established through one fitting operation rather than requiring multiple separate cables

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The connector utilizes the thickness dimension (z-direction) by stacking multiple conductive layers with different spring contact array positions, enabling increased contact capacity without expanding the width dimension, thus maintaining ease of operation while increasing the number of contacts

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Area of stationary object

If the width dimension of the multi-layer board is kept unchanged to maintain compactness, then the connector remains compact, but the number of contacts cannot be increased without adding multiple cables

Engineering Contradiction:
Improvewidth dimension of the boardVSAvoidnumber of contacts
Core Design Contradiction:
Area of stationary objectVSQuantity of substance

Solution Approach 1:

The invention transitions from a two-dimensional contact arrangement to a three-dimensional structure by stacking multiple conductive layers in the thickness direction, each with spring contact arrays at different positions, thereby increasing contact capacity without expanding the board's width dimension

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

Multiple conductive layers are nested within each other in the thickness direction, with each layer containing spring contact arrays positioned at different locations, creating a compact multi-contact structure that fits within the same width footprint

Inventive Principle:
Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables a significant increase in the number of contacts per unit length through a single fitting without expanding the connector's width, enhancing operational efficiency and reliability.

Implementation Method 1

The plurality of spring contacts in the spring contact array have spring properties capable of shifting in the arrangement direction

Methodology Applied
Scientific EffectElasticity: Elasticity

Data Source

PatentUS9647364B2Thin connector
Publication Date: 2017.05.09 JAPAN AVIATION ELECTRONICS IND LTD
  • US9647364B2 patent drawing
  • US9647364B2 patent drawing
  • US9647364B2 patent drawing

AI summary

A thin connector includes a first connector and a second connector both having a flat plate shape, the first connector includes first conductive layers disposed on a first insulating layer and superimposed on one another via an intermediate insulating layer, each first conductive layer has a spring contact array, among the first conductive layers, a first conductive layer closer to the first insulating layer has the spring contact array disposed more frontward in the fitting direction while a first conductive layer farther from the insulating layer has the spring contact array disposed more rearward in the fitting direction, the second connector includes a single second conductive layer disposed on a second insulating layer, the second conductive layer has projection arrays, among the projection arrays, a projection array disposed more frontward in the fitting direction are lower while a projection array disposed more rearward in the fitting direction are higher.