Thin-Core Package Substrate With Carrier Support for Reliable Build-Up
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Solution Overview
Problem
Conventional semiconductor package substrates face challenges in thinning and reliability due to thick core board bodies, which can lead to wrinkles, bends, misalignment, and unevenness of circuit layers during fabrication.
Innovation Solution
A package substrate with a core board body thickness of less than or equal to 20 micrometers, bonded to a carrier with a support board body and metal layer, and formed with conductive vias and circuit layers, along with build-up structures on both sides, to achieve thinning while avoiding reliability issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thick core board body is used for fabricating the circuit structure, then the fabrication process is stable and reliable, but the package substrate cannot meet the thinning requirement
Solution Approach 1:
The patent applies preliminary action by bonding the thin core board body to a carrier before fabricating the circuit structure. This preliminary support prevents wrinkles and bends during subsequent fabrication processes, enabling the use of thin core boards (≤20 μm) without compromising fabrication stability. The carrier provides mechanical support during the build-up process, and is removed after circuit layer formation is complete.
2Length of moving object
If a thin core board body is used to meet thinning requirements, then the package substrate achieves desired thickness, but the core board body is susceptible to wrinkles or bends during fabrication causing circuit layer misalignment
Solution Approach 1:
The patent uses a carrier as an intermediary object to support the thin core board body during fabrication. The carrier acts as a mediator that provides mechanical stability to the thin core board, preventing wrinkles and bends that would cause circuit layer misalignment. After the circuit structure is fabricated, the carrier is removed, leaving the precisely aligned thin package substrate.
3Length of moving object
If a thin core board body is used, then the package substrate meets thinning requirements, but reliability problems occur due to wrinkles, bends, misalignment, or unevenness of circuit layers
Solution Approach 1:
The patent applies preliminary action by providing mechanical support to the thin core board body through a carrier before fabricating the circuit structure. This preliminary support prevents wrinkles, bends, and unevenness during the build-up process, ensuring circuit layers are formed uniformly and reliably. The carrier is removed after fabrication, leaving a reliable thin package substrate without structural defects.
Data Source
AI summary
A package substrate is provided, in which the package substrate is fabricated by using a thin core board body with a thickness of at most 20 micrometers, such that the package substrate can meet the requirement of thinning and avoid reliability problems. A method of fabricating the package substrate is also provided.