Thin Image Display Cooling via Segmented Insulator and Centrifugal Fan
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Solution Overview
Problem
Thin-type image displays face challenges in cooling efficiency due to reduced thickness and weight, leading to increased heat radiation issues and noise from fans, while maintaining high-brightness and high-definition requirements.
Innovation Solution
The solution involves a design with a display panel, a chassis, and insulator boards to maintain electrical insulation and improve airflow, using centrifugal fans to enhance cooling efficiency without increasing fan noise, and integrating image display elements on the lower end to address heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of the image display is reduced to achieve thin-type design, then the depth and weight are reduced, but the cooling efficiency deteriorates due to reduced airflow space and increased heat radiation
Solution Approach 1:
The insulator board is divided into multiple regions with different thermal conductivity characteristics. The first region (facing the chassis) has lower thermal conductivity to prevent heat transfer to the chassis, while the second region (facing the cover) has higher thermal conductivity to facilitate heat dissipation to the cover. This segmentation allows the single component to simultaneously address both heat radiation prevention and dissipation requirements in the reduced thickness design.
Solution Approach 2:
Different portions of the insulator board are assigned different thermal conductivity properties. The first region adjacent to the chassis has thermal conductivity optimized for heat isolation, while the second region adjacent to the cover has thermal conductivity optimized for heat transfer. This local differentiation enables the insulator board to perform multiple thermal management functions within the constrained thin-type structure.
2Length of stationary object
If the distance between substrates and chassis is reduced to achieve thickness reduction, then the overall depth is reduced, but the insulation distance for circuit parts deteriorates and heat dissipation efficiency reduces
Solution Approach 1:
The insulator board serves as an intermediary component positioned between the substrates and the chassis. It provides the necessary electrical insulation and mechanical spacing even when the overall distance is reduced. The board's first region with low thermal conductivity also acts as a thermal barrier, preventing direct heat transfer to the chassis while maintaining the reduced gap required for thin-type design.
3Productivity
If the rotating speed of the axial fan is increased to improve cooling efficiency, then the fan noise increases
Solution Approach 1:
The patent replaces the traditional axial fan cooling system with a centrifugal fan system. The centrifugal fan generates cooling airflow through centrifugal force rather than axial motion, allowing for more efficient heat dissipation at lower rotational speeds. This substitution reduces fan noise while maintaining or improving cooling efficiency, as the centrifugal fan can move air more effectively through the constrained thin-type structure without requiring high rotational velocities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces temperature increases, maintains high reliability, and allows for easy wall hanging with improved design quality by stabilizing heat dissipation and reducing noise.
Implementation Method 1
the insulator board has a very low thermal-conductivity of around 0.1 to 1 (W/m·° K), compared to the thermo conductivity of the chassis made of a metal material... the insulator board on the base chassis prevents a flow of heat dissipation into air within the inside of the image display, from the display panel through the chassis
Implementation Method 2
using centrifugal fans to enhance cooling efficiency without increasing fan noise
Implementation Method 3
heat radiation of the display panel through the chassis is reduced
Data Source
AI summary
For improving a cooling efficiency of a display panel in a flat-type image display, various substrates and an image display element are disposed within a thin-sized housing thereof, including: a display panel; a chassis supporting the display panel from a rear surface side thereof; a front surface-side cover on a front side of the display panel; a rear surface-side cover on a rear side of the display panel; an image display element connected to the display panel; a display driver substrate connected to the display panel, and on a surface thereof opposite to the chassis are provided circuit parts; a power source substrate, supplying driving power to the display driver substrate and the image display element, and on a surface thereof opposite to the chassis are provided circuit parts thereof; and a first insulator board opposite to the display driver substrates and the power source substrate of the chassis.