Thin Electrode Ink Jet Head Chip Yield
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Ink jet printer technologies face challenges in achieving high yield and manufacturing efficiency due to thick electrode film thickness and narrow channel groove widths, leading to decreased yield and formation of burrs during the electrode forming process.
Innovation Solution
A liquid ejecting head chip with an actuator plate featuring channels narrower than 70 μm, where the in-channel electrodes are formed with a film thickness of 0.5 μm or smaller, and the surface is roughened for improved plating adhesion, allowing for thinner electrodes that can be easily separated without influencing the piezoelectric base material, thus enhancing yield and reducing burr formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the film thickness of the electrode is increased to 1 μm or more, then the electrode strength and durability are improved, but the yield of the electrode forming process decreases significantly
Solution Approach 1:
The patent changes the film thickness parameter from the conventional 1 μm or more to 0.01 μm or more but less than 1 μm. This parameter change resolves the contradiction by achieving sufficient electrode functionality while dramatically improving yield. The thinner film reduces plating defects and manufacturing issues that occur with thicker films, thereby increasing productivity without compromising essential electrode performance.
Solution Approach 2:
The patent applies hydraulic principles by using liquid electrolyte in the plating process to achieve uniform thin film deposition. The liquid medium enables precise control of film thickness at the sub-micron level, allowing formation of electrodes with 0.01-1 μm thickness that would be difficult to achieve with other methods. This hydraulic approach ensures consistent quality and high yield in the electrode forming process.
2Quantity of substance
If the channel groove width is reduced to increase nozzle density, then the high density of nozzles is achieved, but the yield decreases because the plating process becomes more difficult
Solution Approach 1:
The patent changes the electrode film thickness parameter to compensate for the reduced channel groove width. By using thinner electrodes (0.01-1 μm) instead of thicker ones (1 μm or more), the patent enables successful plating in narrow channels (less than 70 μm) where thicker electrodes would fail. This parameter change allows high nozzle density while maintaining high yield.
Solution Approach 2:
The patent applies local quality by making the electrode film thickness adaptive to the local channel width. In narrow channels where high nozzle density is required, the thinner electrode film (0.01-1 μm) provides sufficient conductivity and mechanical integrity without causing plating defects. This localized optimization allows different effective electrode thicknesses in different regions, enabling high density while maintaining yield.
3Productivity
If the electrode film thickness is reduced to 0.5 μm or smaller, then the yield of actuator plate is improved and burr formation is reduced, but the electrode conductivity may be compromised
Solution Approach 1:
The patent optimizes the film thickness parameter to the range of 0.01 μm or more but less than 1 μm, with particular emphasis on 0.5 μm or smaller. This parameter change improves yield by reducing plating defects and burr formation while maintaining sufficient conductivity through careful control within this specific range. The lower bound (0.01 μm) ensures minimum conductivity requirements are met.
Solution Approach 2:
The patent implements feedback control in the plating process to maintain electrode film thickness within the optimal 0.01-1 μm range. By monitoring and adjusting plating parameters in real-time, the system ensures consistent film thickness that balances conductivity requirements with yield improvement. This feedback mechanism prevents both overly thin films (insufficient conductivity) and overly thick films (reduced yield).
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The approach improves the yield of the actuator plate by allowing for thinner electrode formation, reducing burr formation, and enabling easier separation without degrading the piezoelectric base material, thereby enhancing manufacturing efficiency and product quality.
Implementation Method 1
the in-channel electrode is a plating film
Implementation Method 2
a surface of the actuator plate, on which the in-channel electrode is formed is a roughened surface for the plating film
Data Source
AI summary
According to an embodiment, an ink jet head (liquid ejecting head) includes an actuator plate and a cover plate (see FIG. 8). As illustrated in FIG. 1, channel grooves for a discharge channel (ejection channel) and a non-discharge channel (non-ejection channel) in a Z-direction are formed on a front surface of the actuator plate, so as to be alternately arranged in an X-direction, by cutting with a dicing blade or the like. The discharge channel and the non-discharge channel are formed to have a groove width W of smaller than 70 μm, in order to correspond to high density of nozzles. In the embodiment, the discharge channel and the non-discharge channel are formed to have a groove width of 55 μm, 50 μm, or 40 μm, for example.