Thin EMI Shielded Package With Surface Marking Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing integrated device packages face challenges in achieving a reduced thickness while effectively shielding electronic components from electromagnetic interference and accommodating markings for identification and alignment.
Innovation Solution
The integration of an electromagnetic interference (EMI) shield layer with a thickness ranging from 2 μm to 6 μm, featuring ink or laser markings, and a through mold via that allows for reduced thickness and electromagnetic isolation between components, eliminating the need for additional gaps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a traditional EMI shield structure is used, then electromagnetic shielding effectiveness is improved, but package thickness increases
Solution Approach 1:
The patent applies a thin film EMI shield layer (2-6 μm) instead of traditional bulky shield structures. This thin film is integrated into the molding compound, providing effective EMI shielding while maintaining a reduced package thickness profile suitable for small form-factor devices.
Solution Approach 2:
The EMI shield layer is merged with the molding compound to form an integrated structure. The shield layer is embedded within the molding material that encapsulates the electronic components, combining the protective molding function with EMI shielding in a single integrated layer.
2Measurement precision
If markings are added to the EMI shield layer, then identification and alignment capability is improved, but manufacturing complexity increases
Solution Approach 1:
Markings are pre-formed on the EMI shield layer during the molding process itself, rather than being added as a separate post-processing step. The markings are created by incorporating colored pigments or patterns into the molding compound before injection, enabling alignment identification while streamlining manufacturing.
3Length of stationary object
If the package thickness is reduced, then compatibility with small form-factor devices is improved, but EMI shielding effectiveness deteriorates
Solution Approach 1:
The patent utilizes advanced thin film technology to achieve effective EMI shielding in a ultra-thin format. The 2-6 μm shield layer demonstrates that high-performance EMI protection can be achieved at minimal thickness through optimized material composition and integration methods.
Solution Approach 2:
The EMI shield layer is formed using composite materials that combine EMI-shielding particles or structures with a polymer matrix. This composite approach enables effective shielding performance in a thin profile by distributing shielding functionality throughout the material volume rather than relying on thick solid barriers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration results in a thinner integrated device package with effective EMI shielding and visible markings for identification, enhancing compatibility with small form-factor electronic devices.
Implementation Method 1
The electromagnetic interference shield layer is configured to shield the electronic component from a radio frequency
Data Source
AI summary
An integrated device package is disclosed. The integrated device package can include a carrier, an electronic component mounted on the carrier, a molding material disposed over the carrier, and an electromagnetic interference shield layer disposed over the molding material. The electronic component is at least partially disposed in the molding material. The electromagnetic interference shield layer is configured to shield the electronic component from a radio frequency signal. The electromagnetic interference shield layer has a thickness in a range between 2 μm and 6 μm. A surface of the electromagnetic interference shield layer includes an ink mark that has a thickness in a range between 5 μm and 15 μm, or a laser mark that has a depth in a range between 1 μm and 2 μm.