Thin EMI-Shielded Package Structure With Integrated Markings
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Solution Overview
Problem
Existing integrated device packages are challenged by the need for reduced thickness to fit within small form-factor electronic devices while maintaining effective electromagnetic interference shielding and component alignment/identification markings.
Innovation Solution
The integrated device package incorporates an electromagnetic interference shield layer with a thin thickness (2-6 μm) and markings, such as ink or laser marks, embedded within a molding material, and utilizes through mold vias and ground connections to minimize package thickness without gaps, ensuring effective shielding and visibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a traditional package structure with separate shielding layer and markings is used, then electromagnetic shielding effectiveness is maintained, but package thickness increases
Solution Approach 1:
The patent combines the EMI shielding layer and identification markings into a single integrated layer. The shielding layer itself is patterned or marked directly, eliminating the need for separate shielding and marking layers. This merging reduces the overall package thickness while maintaining both electromagnetic shielding effectiveness and component identification capabilities.
Solution Approach 2:
The shielding layer is designed to serve multiple functions simultaneously: providing electromagnetic interference shielding, enabling component identification through integrated markings, and maintaining structural integrity. This multi-functionality allows a single layer to replace what would traditionally require multiple separate layers, thereby reducing package thickness.
2Reliability
If additional gaps are added for traditional shielding structures, then electromagnetic isolation is improved, but package thickness increases
Solution Approach 1:
The grounding connections and shielding functions are merged into the same integrated layer structure. Grounding vias or conductive paths are formed within the shielding layer itself, eliminating the need for separate grounding layers or additional gaps between shielding and grounding structures. This integration maintains electromagnetic isolation while reducing overall package thickness.
3Measurement precision
If separate marking layers are added for component alignment, then identification accuracy is improved, but package thickness increases
Solution Approach 1:
The identification markings are integrated directly into the EMI shielding layer through patterning or direct marking on the shielding material itself. This eliminates the need for separate marking layers while maintaining accurate component alignment and identification. The markings are formed as part of the shielding layer fabrication process, reducing overall package thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves a reduced thickness (420-750 μm) with efficient RF signal shielding and clear markings, enhancing compatibility with miniaturized electronic devices.
Implementation Method 1
The electromagnetic interference shield layer is configured to shield the electronic component from a radio frequency
Data Source
AI summary
An integrated device package is disclosed. The integrated device package can include a carrier, an electronic component mounted on the carrier, a molding material disposed over the carrier, and an electromagnetic interference shield layer disposed over the molding material. The electronic component is at least partially disposed in the molding material. At least a portion of the shield layer is in contact with the electronic component. The electromagnetic interference shield layer is configured to shield the electronic component from a radio frequency signal. A surface of the electromagnetic interference shield layer includes an ink mark or a laser mark.