Thin Faceplate Structure for Thermal Expansion in Process Chambers

Solution Overview

Problem

Conventional faceplates in semiconductor processing chambers deform due to thermal expansion, requiring thick designs and multiple drill passes, which increase manufacturing time and cost.

Innovation Solution

A faceplate design with an inner section, outer section, and a thermal expansion section connecting them, allowing the inner section to expand without buckling and maintaining planarity, while reducing thickness for single-pass drilling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If the faceplate is made thick to prevent thermal expansion deformation, then the faceplate stability is improved, but the manufacturing time and cost increase due to multiple drill passes

Engineering Contradiction:

Improvefaceplate stabilityVSAvoidmanufacturing time

Core Design Contradiction:

Stability of the object's compositionVSLoss of time

Solution Approach 1:

The faceplate is divided into three distinct sections: an inner section with apertures, an outer section with ring shape, and a thermal expansion section connecting them. This segmentation allows each part to serve its specific function - the inner section for gas distribution, the outer section for structural support, and the thermal expansion section for accommodating thermal deformation without compromising overall stability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The thermal expansion section is designed with a specific thickness parameter that is less than both the inner and outer sections. This parameter change creates a flexible zone that can deform thermally while the thicker inner and outer sections maintain structural integrity, thus preventing faceplate buckling without requiring excessive thickness throughout the entire structure.

Inventive Principle:

Principle #35Parameter changes

2Stability of the object's composition

If the faceplate is made thick to prevent thermal expansion deformation, then the faceplate stability is improved, but the manufacturing cost increases

Engineering Contradiction:

Improvefaceplate stabilityVSAvoidmanufacturing cost

Core Design Contradiction:

Stability of the object's compositionVSEase of manufacture

Solution Approach 1:

The faceplate is divided into three distinct sections: an inner section with apertures, an outer section with ring shape, and a thermal expansion section connecting them. This segmentation allows each part to serve its specific function - the inner section for gas distribution, the outer section for structural support, and the thermal expansion section for accommodating thermal deformation without compromising overall stability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The thermal expansion section is designed with a specific thickness parameter that is less than both the inner and outer sections. This parameter change creates a flexible zone that can deform thermally while the thicker inner and outer sections maintain structural integrity, thus preventing faceplate buckling without requiring excessive thickness throughout the entire structure.

Inventive Principle:

Principle #35Parameter changes

3Loss of time

If the faceplate thickness is reduced for single-pass drilling, then the manufacturing time is reduced, but the faceplate may deform due to thermal expansion

Engineering Contradiction:

Improvemanufacturing timeVSAvoidfaceplate stability

Core Design Contradiction:

Loss of timeVSStability of the object's composition

Solution Approach 1:

The faceplate is divided into three distinct sections: an inner section with apertures, an outer section with ring shape, and a thermal expansion section connecting them. This segmentation allows each part to serve its specific function - the inner section for gas distribution, the outer section for structural support, and the thermal expansion section for accommodating thermal deformation without compromising overall stability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The thermal expansion section is designed with a specific thickness parameter that is less than both the inner and outer sections. This parameter change creates a flexible zone that can deform thermally while the thicker inner and outer sections maintain structural integrity, thus preventing faceplate buckling without requiring excessive thickness throughout the entire structure.

Inventive Principle:

Principle #35Parameter changes

4Ease of manufacture

If the faceplate thickness is reduced for single-pass drilling, then the manufacturing cost is reduced, but the faceplate may deform due to thermal expansion

Engineering Contradiction:

Improvemanufacturing costVSAvoidfaceplate stability

Core Design Contradiction:

Ease of manufactureVSStability of the object's composition

Solution Approach 1:

The faceplate is divided into three distinct sections: an inner section with apertures, an outer section with ring shape, and a thermal expansion section connecting them. This segmentation allows each part to serve its specific function - the inner section for gas distribution, the outer section for structural support, and the thermal expansion section for accommodating thermal deformation without compromising overall stability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The thermal expansion section is designed with a specific thickness parameter that is less than both the inner and outer sections. This parameter change creates a flexible zone that can deform thermally while the thicker inner and outer sections maintain structural integrity, thus preventing faceplate buckling without requiring excessive thickness throughout the entire structure.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design maintains faceplate planarity, reduces manufacturing time and cost, enhances deposition uniformity, and improves substrate processing efficiency.

Implementation Method 1

The faceplate is often subject to elevated temperatures, such as 200 degrees Celsius or greater, during the deposition process. This elevated temperature often causes the faceplate bow or buckle due to thermal expansion

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS20260015724A1Thin faceplate design for use in a processing chamber

Publication Date: 2026.01.15 APPLIED MATERIALS INC

AI summary

Embodiments of the present disclosure generally relate to a faceplate including a thermal expansion section for use in a semi-conductor processing chamber. In one or more embodiments, a faceplate for a process chamber includes an inner section. The inner section includes a plurality of apertures. The faceplate further includes an outer section having a ring shape. The outer section surrounds the inner section. The faceplate further includes a thermal expansion section having a thickness less than a thickness of the inner section and a thickness the outer section. The thermal expansion section connects the inner section and the outer section. The thermal expansion section is configured to deform when the inner section expands.