Thin Film Battery Integration on Semiconductor Surfaces
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Solution Overview
Problem
Existing electrochemical devices, such as batteries, face challenges in encapsulation due to environmentally sensitive materials, and traditional encapsulation methods like gold foil or metal and plastic pouches are costly and prone to seal failures from temperature changes.
Innovation Solution
A thin-film battery is fabricated on a semiconducting or conductive surface using a bonding layer with embedded conductors, which provides selective electrical contact and insulation, allowing for direct integration with semiconductor devices or flexible printed circuit boards, and can be encapsulated using a thinner, more reliable method.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional encapsulation methods like gold foil or metal and plastic pouches are used, then environmentally sensitive materials are protected, but cost increases and seal failures occur due to temperature changes
Solution Approach 1:
The patent employs thin-film encapsulation layers deposited directly onto the battery structure, replacing traditional rigid pouches and foil seals. These thin films conform to the battery geometry and provide environmental protection without requiring high-temperature sealing processes that cause expansion and contraction issues.
Solution Approach 2:
The encapsulation system uses composite thin-film structures combining multiple materials with complementary properties - such as barrier layers for chemical protection, conductive layers for electrical function, and flexible substrates for mechanical compliance. This composite approach provides reliable protection across temperature variations without seal failure.
2Reliability
If thick encapsulation layers are used to protect sensitive materials, then environmental protection is improved, but device flexibility and integration with semiconductor surfaces are reduced
Solution Approach 1:
The patent utilizes thin-film encapsulation structures that provide environmental protection while maintaining flexibility and conformality to semiconductor surfaces. These thin films can be deposited directly onto irregular surfaces and integrated circuits, enabling direct mounting without rigid enclosures.
Solution Approach 2:
The encapsulation transitions from three-dimensional rigid pouches to two-dimensional thin-film layers that conform to the battery and semiconductor surface geometry. This dimensional reduction enables better integration while maintaining protective function.
3Reliability
If separate encapsulation components are used, then protection is provided, but device complexity and manufacturing steps increase
Solution Approach 1:
The patent combines multiple encapsulation functions into integrated thin-film layers that simultaneously provide environmental barrier, electrical insulation, and mechanical support. The encapsulation is merged with the battery structure itself through direct deposition, eliminating separate encapsulation components and assembly steps.
Solution Approach 2:
The thin-film encapsulation layers perform multiple functions simultaneously - providing chemical barrier protection, electrical insulation, mechanical reinforcement, and thermal management. This multi-functionality reduces the number of separate components needed while improving overall device reliability.
Data Source
Figure 1A~1B
Figure 2
Figure 3A~3B
AI summary
An integrated circuit including a battery, comprising: a semiconductor device (105) or a flexible printed circuit board (305) having a surface; a bonding layer (110; 310) coupled with the surface of the semiconductor device or the flexible printed circuit board, the bonding layer comprising an embedded conductor (120; 320); a battery cell structure (115; 315) in selective electrical contact with the surface via the embedded conductor; and a first electrical contact (101; 301) coupled with the battery cell structure, wherein the bonding layer and the battery cell structure are sandwiched between the surface and the first electrical contact.