Monolithic Thin-Film Brain Interface Leads With Fewer Failure Points
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Solution Overview
Problem
Conventional neuromodulation devices suffer from disconnections and fractures of system components due to the use of separate electrodes, conductors, and connectors, which are prone to hardware migration, especially in deep implants.
Innovation Solution
A monolithic thin-film lead assembly with a supporting structure and integrated conductive traces, eliminating separate connectors and reducing connection points, is fabricated using microfabrication techniques, allowing for a more flexible and durable design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional electrodes, conductors, and connectors are used as separate components, then the system can be assembled using standard manufacturing processes, but the number of connection points increases leading to higher risk of disconnections and fractures
Solution Approach 1:
The patent combines electrodes, conductors, and connectors into a single monolithic thin-film lead assembly fabricated using microfabrication techniques. This integration eliminates multiple connection points between separate components, thereby reducing the risk of disconnections and fractures while maintaining manufacturability through standardized microfabrication processes
2Adaptability or versatility
If the lead assembly uses multiple connectors and extension wires, then the system can accommodate deep implantation requirements, but the complexity of the assembly increases and mechanical failure points increase
Solution Approach 1:
The patent integrates electrodes, conductors, and connectors into a single monolithic thin-film structure, eliminating the need for separate extension wires and multiple connectors. This reduction in component count simplifies the overall assembly structure while maintaining the adaptability required for deep implantation through the flexible nature of the thin-film construction
3Ease of manufacture
If conventional lead assemblies with multiple connection points are used, then the system can be manufactured with standard components, but the probability of fractures and disconnections increases due to hardware migration
Solution Approach 1:
The patent fabricates a monolithic thin-film lead assembly that integrates electrodes, conductors, and connectors as a single unit, eliminating multiple connection points where hardware migration and fractures could occur. The integrated structure maintains manufacturability through microfabrication processes while significantly improving fracture resistance
4Strength
If the supporting structure uses thicker dielectric material layers, then the mechanical strength and protection are improved, but the flexibility and ability to conform to implantation sites is reduced
Solution Approach 1:
The patent employs thin-film dielectric material layers with optimized thickness parameters that balance structural integrity and flexibility. By precisely controlling the thickness of dielectric layers in the microfabricated structure, the assembly achieves sufficient mechanical strength while maintaining the flexibility needed to conform to various implantation sites
Data Source
AI summary
The present disclosure relates to a monolithic thin-film lead assembly and methods of microfabricating a monolithic thin-film lead assembly. Particularly, aspects of the present disclosure are directed to a monolithic thin-film lead assembly that includes a cable having a proximal end, a distal end, a supporting structure that extends from the proximal end to the distal end, and conductive traces formed on a portion of the supporting structure. The supporting structure includes one or more layers of dielectric material. The monolithic thin-film lead assembly further includes an interface formed on the supporting structure at the distal end of the cable. The interface includes electrodes and/or sensors in electrical connection with the conductive traces, and the supporting structure has at least one curved portion disposed between a first set of electrodes and a second set of electrodes, and/or between a first set of sensors and a second set of sensors.