Thin Film Capacitor Self-Repair via Multilayer Electrode Design
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Solution Overview
Problem
Thin film capacitors embedded in circuit boards face challenges in self-repairing short-circuit defects due to dielectric breakdown, as the use of low-resistance materials like Cu for capacitive electrodes hinders the effectiveness of existing self-repair methods.
Innovation Solution
A thin film capacitor design featuring a second capacitive electrode with a multilayer structure, where a high-resistivity conductor film is used in conjunction with a low-resistivity conductor film, allowing for increased resistance in the fuse areas through reduced thickness, width, and selective removal, enabling reliable self-repair by fusing the fuse areas during dielectric breakdown.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the second capacitive electrode is divided into multiple capacitor areas connected through fuse areas, then self-repair capability is enabled, but the resistance value of the fuse area decreases when using low-resistance materials
Solution Approach 1:
The electrode structure employs different resistance characteristics in different regions: the capacitor areas use low-resistance Cu material for minimal ESR, while the fuse areas incorporate higher-resistance configurations (through reduced thickness, width, or selective removal of the low-resistivity film) to ensure proper fusion during self-repair. This local differentiation resolves the contradiction between low ESR and reliable fuse operation.
Solution Approach 2:
The resistance value of the fuse area is controlled by changing physical parameters of the conductor films, such as reducing the thickness or width of the second conductor film in the fuse area, or selectively removing it. These parameter adjustments increase the fuse area resistance to appropriate levels for self-repair while maintaining low ESR in the capacitor areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively self-repairs short-circuit defects by ensuring reliable fusion of fuse areas, maintaining capacitor functionality and reducing Equivalent Series Resistance (ESR) when embedded in circuit boards.
Implementation Method 1
the first conductor film having a high electrical resistivity, so that by correspondingly reducing the film thickness of the second conductor film having a low electrical resistivity, the resistance value of the fuse area can be increased. This allows the fuse area to be fused properly at the time of occurrence of a short-circuit defect due to dielectric breakdown.
Implementation Method 2
when the thin film capacitor is applied with a high voltage, a capacitive insulating film thereof undergoes dielectric breakdown, which may cause a short-circuit defect.
Data Source
AI summary
Disclosed herein is a thin film capacitor that includes a capacitive insulating film having first and second surfaces opposite to each other, a first capacitive electrode covering the first surface of the capacitive insulating film, and a second capacitive electrode covering the second surface of the capacitive insulating film and including a plurality of capacitor areas divided by a slit and a plurality of fuse areas connecting two of adjacent capacitor areas. The second capacitive electrode has a structure in which a plurality of conductor films including a first conductor film and a second conductor film lower in electrical resistivity than the first conductor film are laminated.