Thin Film Laser Perforation for Cleaner Chip Release

The laser perforation process is divided into multiple passes: a first pass creates the initial hole with minimal burr generation, and a second pass removes the hanging chips and burrs. This segmentation of the perforation process into distinct stages allows each pass to be optimized for its specific function, reducing overall defects while maintaining precision.

The first laser pass performs a preliminary perforation that creates the hole structure before the second pass removes defects. By preparing the hole structure in advance with controlled burr formation, the second pass can efficiently remove hanging chips without requiring excessive energy or time, thus resolving the contradiction between precision and harmful byproducts.

The second laser pass applies partial action by targeting only the specific regions with hanging chips and burrs rather than re-perforating the entire hole. This selective approach removes defects efficiently while minimizing additional cycle time, achieving cut quality improvement without excessive time loss.

The perforation process uses periodic action with two distinct laser passes: the first pass creates the hole, and the second pass periodically removes defects. This periodic structure allows the system to maintain high cut quality by systematically addressing hanging chips at regular intervals without continuously extending the cycle time.

The use of periodic laser passes with controlled energy levels allows efficient chip removal without excessive energy input. The first pass operates at one energy level to create the hole, and the second pass operates at a different energy level optimized for chip removal, thereby improving productivity while controlling ablation damage and soot generation through energy modulation.

The laser system changes parameters between passes, including energy level, pulse duration, and scanning speed. The second pass uses modified parameters optimized for chip removal rather than hole creation, enabling faster chip release while minimizing ablation damage and soot by adjusting the energy delivery characteristics to match the specific requirements of each process stage.