Thin-Film Coil Layout for Higher Inductance and Connection Rigidity
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Solution Overview
Problem
Miniaturized thin film inductors face challenges in securing high capacity and quality factor due to reduced coil area and compromised connection reliability and structural rigidity, especially when external forces are applied.
Innovation Solution
A coil component design featuring a support substrate with first and second coil portions, lead-out portions, and connection portions, where the coil portions are arranged to maximize area and increase turns, and the connection reliability is enhanced through specific lead-out and connection configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the chip size of the thin film type inductor is reduced, then the component size is miniaturized, but the volume of the main body is reduced, the space for forming the coil is reduced, and the number of turns of the formed coil is decreased
Solution Approach 1:
The patent transitions from a planar coil configuration to a three-dimensional coil structure that extends vertically within the main body. The coil is formed to wrap around a central axis in the thickness direction, utilizing the Z-dimension to increase the number of turns without increasing the planar footprint. This dimensional transition allows maintaining high turn count in miniaturized components.
Solution Approach 2:
The coil structure is nested within the main body, with the coil winding around a central region and the magnetic sheet containing the coil being embedded within the overall component structure. The lead-out portions are also nested within the main body before extending to the external electrodes, maximizing space utilization.
2Area of stationary object
If the area for forming the coil is reduced, then the component is miniaturized, but it becomes difficult to secure high capacity, and the width of the coil may become small, to increase the direct current (DC) and alternating current (AC) resistances and to decrease a quality factor (Q)
Solution Approach 1:
The coil is configured to extend in the thickness direction with multiple turns wrapped around a central axis, transforming from a two-dimensional planar coil to a three-dimensional helical structure. This increases the effective coil area and number of turns without increasing the planar footprint, thereby maintaining low resistance and high quality factor in miniaturized components.
Solution Approach 2:
The patent uses a composite structure consisting of a magnetic sheet containing the coil, embedded within a main body that may include magnetic powder particles mixed with resin. This composite construction enhances the magnetic properties and electrical characteristics of the inductor, maintaining high capacity and quality factor despite reduced size.
3Volume of moving object
If a thin coil component is manufactured, then the component is miniaturized, but there may be a problem in that connection reliability and structural rigidity between the conductor and the body may be deteriorated, when external force or the like is applied
Solution Approach 1:
The lead-out portions are formed to extend from the coil ends through the main body to the external electrodes, creating predetermined connection paths before external forces are applied. This preliminary structural arrangement ensures that connection points are pre-established and reinforced, maintaining connection reliability under external stress.
Solution Approach 2:
The main body is constructed as a composite material containing magnetic powder particles mixed with resin, providing both structural support and mechanical strength. This composite structure enhances the rigidity and connection reliability of the thin component, preventing deterioration when external forces are applied.
Data Source
AI summary
A coil component includes a support substrate; first and second coil portions, respectively arranged on the support substrate; a body embedding the support substrate and the first and second coil portions therein; first and second lead-out portions, respectively connected to end portions of the first and second coil portions and exposed from one surface to be spaced apart from each other; and first and second connection portions, respectively connecting the end portions of the first and second coil portions to the first and second lead-out portions, wherein a line width of one end of each of the first and second connection portions connected to the respective end portion of the first and second coil portions is smaller than a line width of another end of each of the first and second connection portions connected to a respective one of the first and second lead-out portions.