Thin-Film Electronic Component for Miniaturized Common Mode Filter
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional common mode filters are difficult to miniaturize and manufacture at a low cost due to the use of thick ferrite substrates and complex electrode structures, which result in high manufacturing costs and precision issues with terminal electrodes.
Innovation Solution
A thin-film electronic component with a substrate, a thin-film element layer, and bump electrodes on the surface, where the thin-film element layer contains a spiral conductor, and an insulator layer between the bump electrodes, allowing for precise external terminal formation and reduced material usage, enabling miniaturization and cost-effective production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional ferrite substrates are used in common mode filters, then mechanical strength and magnetic properties are improved, but the filter becomes thicker and more expensive
Solution Approach 1:
The patent changes the substrate material from conventional ferrite to thin-film material, fundamentally altering the physical parameters of the substrate. This enables the substrate to be much thinner while maintaining sufficient mechanical strength through the thin-film fabrication process and structural design, directly resolving the contradiction between mechanical strength and substrate thickness
Solution Approach 2:
The patent employs composite material structures in the thin-film element layer, combining multiple functional layers (conductor layers, insulating layers, magnetic layers) to achieve both mechanical integrity and electromagnetic functionality in a thin profile, thereby maintaining strength while reducing overall substrate thickness
2Reliability
If conventional terminal electrode structures are used, then electrical connectivity is achieved, but manufacturing precision is poor and costs increase
Solution Approach 1:
The patent replaces the conventional mechanical/sputtering-based terminal electrode formation with a thin-film fabrication process that uses photolithography and electroplating. This substitution enables much higher manufacturing precision in terminal electrode positioning and dimensions, while maintaining reliable electrical connectivity through the precisely formed contact holes and conductive paths
Solution Approach 2:
The patent performs preliminary formation of contact holes and conductor patterns in the thin-film element layer before final terminal electrode fabrication. This preliminary action establishes precise alignment references that guide subsequent terminal electrode formation, ensuring high manufacturing precision and reliable electrical connectivity
3Reliability
If conventional common mode filter structures are used, then filter performance is achieved, but miniaturization is difficult and costs are high
Solution Approach 1:
The patent fundamentally changes the fabrication parameters from conventional thick-film/sputtering processes to thin-film processes, enabling the entire filter structure to be scaled down. The thin-film element layer with its multi-layer conductor-insulator-magnetic structure achieves the required filter performance in a much smaller volume, directly enabling miniaturization while maintaining performance
Solution Approach 2:
The patent employs a nested multi-layer structure where conductor layers, insulating layers, and magnetic layers are stacked sequentially in the thin-film element layer. This nesting approach packs multiple functional elements into a compact vertical arrangement, achieving complete filter functionality in a minimized volume
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for the creation of a miniaturized, low-cost common mode filter with improved precision in electrode formation and reduced material costs, while maintaining desired filter performance by using bump electrodes for external connections and omitting unnecessary layers.
Implementation Method 1
a thin-film element layer provided on the substrate, first and second bump electrodes provided on a surface of the thin-film element layer... the thin-film element layer contains a first spiral conductor, which is a plane coil pattern
Data Source
AI summary
An electronic component is provided with a substrate, a thin-film element layer provided on the substrate, first and second bump electrodes, provided on a surface of the thin-film element layer, and an insulator layer provided between the first bump electrode and the second bump electrode. The thin-film element layer contains a first spiral conductor which is a plane coil pattern. The first bump electrode is connected to an internal peripheral end of the first spiral conductor. The second bump electrode is connected to an external peripheral end of the first spiral conductor. Both of the first and second bump electrodes, have a first exposure surface exposed to a principal surface of the insulator layer and a second exposure surface exposed to an end face of the insulator layer.