Thin Film Deposition Guide for Substrate Uniformity
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Solution Overview
Problem
Conventional thin film forming methods face challenges in maintaining consistent film quality and efficiency when forming oxide superconductors on both sides of a substrate, leading to degradation and unevenness due to timing changes and chemical instability, which affects the operational stability and productivity of microwave devices.
Innovation Solution
A method and apparatus that expose both sides of the substrate to particulate thin film material, converging and increasing its density for simultaneous deposition, using a guide with a parallel and inclined portion to control the material's trajectory and a rotating substrate to ensure uniform thickness, while heaters address temperature unevenness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If thin films are formed on both sides of the substrate separately using conventional methods, then the film formation process is simple to implement, but the film quality becomes uneven and degrades due to timing changes and chemical instability
Solution Approach 1:
The patent combines two separate film formation processes into a single simultaneous operation by introducing particulate thin film material to both sides of the substrate at the same time. This merging of processes eliminates timing differences between film formations, ensuring consistent film quality on both surfaces while maintaining process feasibility through the use of a unified deposition system
2Productivity
If the particulate thin film material is accelerated to high energy state for fast film formation, then the film formation speed increases and productivity improves, but the damage to the thin film surface becomes serious
Solution Approach 1:
The patent changes the energy state parameter of the particulate thin film material by controlling the acceleration energy to be below a specific threshold. This parameter adjustment allows the material to deposit on the substrate without causing excessive surface damage, while still maintaining adequate film formation speed through optimized deposition conditions
3Manufacturing precision
If the acceleration of particulate thin film material is reduced to minimize surface damage, then the thin film surface quality improves, but the film formation speed drops and productivity decreases
Solution Approach 1:
The patent merges the deposition process for both sides of the substrate into a single simultaneous operation, which compensates for the reduced film formation speed on each individual side. The combined productivity of processing both surfaces together maintains overall production efficiency while the reduced acceleration ensures high surface quality without excessive damage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances film quality uniformity, reduces production time and energy consumption, improves productivity, and stabilizes the operating characteristics of microwave devices by forming high-quality thin films on both substrate surfaces simultaneously.
Implementation Method 1
by supplying electric power to the cathode 3, the particulate thin film material 2A is sputtered out of the target 2B
Implementation Method 2
the substrate 1 is fixed to a heat stage 13, and is heated from a backside 1B of the first principal surface 1A of the substrate 1
Data Source
AI summary
This is a thin film forming apparatus which is equipped with a target constructed of a thin film material, a cathode for generating a particulate thin film material from the target, a supporting member for supporting the substrate on which the particulate thin film material is to be deposited, a heater for heating the substrate, and a guide for introducing the particulate thin film material onto a surface of the substrate where the thin film material is deposited, wherein the supporting member supports the substrate so as to expose the first principal surface and its backside (second principal surface) of the substrate, the target is disposed in a position for producing the particulate thin film material in an extension of the first principal surface of the substrate, and the guide is disposed on the first principal surface and the second principal surface of the substrate.